Inventor · disambiguated record
Chuan-Fa Lin
Also filed as: LIN CHUAN-FA
6 granted patents·9 pending applications·13 citations·filing 2004–2024
76Inventor score
Top patents by PatentIndex Score
15 records- 0169US7804162B2Multi-wavelength white light-emitting structureHARVATEK CORP·Filed 2009·Granted Sep 28, 2010·4 cites·13 claims
- 0268US8643273B2Light emitting diode device having pillars disposed such that light efficiency of the device is improvedCHIANG CHUNG-I·Filed 2012·Granted Feb 4, 2014·1 cites·3 claims
- 0367US8632237B2Light guide plate with adjustable illumination angle, illumination device with adjustable illumination angle, and method for adjusting illumination angle thereofCHIANG CHUNG-I·Filed 2012·Granted Jan 21, 2014·2 cites·19 claims
- 0461US7655997B2Wafer level electro-optical semiconductor manufacture fabrication mechanism and a method for the sameHARVATEK CORP·Filed 2005·Granted Feb 2, 2010·2 cites·11 claims
- 0558US2025120617A1Non-invasive blood glucose monitoring device and manufacturing method thereofTAIWAN ASIA SEMICONDUCTOR CORP·Filed 2024·Application pending·0 cites
- 0656US2014103382A1High efficiency light emitting diode deviceWALSIN LIHWA CORP·Filed 2013·Application pending·0 cites
- 0754US8513886B1Light emitting diode deviceWALSIN LIHWA CORP·Filed 2013·Granted Aug 20, 2013·0 cites·18 claims
- 0854US2024188857A1Biomedical detection photoelectric module and manufacturing method thereofTAIWAN ASIA SEMICONDUCTOR CORP·Filed 2023·Application pending·0 cites
- 0946US7276782B2Package structure for semiconductorHARVATEK CORP·Filed 2004·Granted Oct 2, 2007·4 cites·16 claims
- 1046US2006261488A1Wafer level electro-optical simiconductor manufacture fabrication mechanism and a method for the sameHARVATEK CORP·Filed 2006·Application pending·0 cites
- 1146US2012094407A1Wafer level led package structure for increasing light-emitting efficiency and heat-dissipating effect and method for manufacturing the sameWANG BILY·Filed 2011·Application pending·0 cites
- 1244US2010301349A1Wafer level led package structure for increasing light-emitting efficiency and heat-dissipating effect and method for manufacturing the sameHARVATEK CORP·Filed 2010·Application pending·0 cites
- 1343US2013026524A1Light emitting diodeWALSIN LIHWA CORP·Filed 2012·Application pending·0 cites
- 1441US2006249739A1Multi-wavelength white light emitting diodeWANG BILY·Filed 2006·Application pending·0 cites
- 1541US2006258031A1Wafer-level electro-optical semiconductor manufacture fabrication methodWANG BILY·Filed 2006·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →