Inventor · disambiguated record
Hironao Ootake
Also filed as: OOTAKE HIRONAO
4 granted patents·17 pending applications·15 citations·filing 2008–2017
69Inventor score
Top patents by PatentIndex Score
21 records- 0178US8119236B2Dicing die-bonding filmKAMIYA KATSUHIKO·Filed 2009·Granted Feb 21, 2012·8 cites·10 claims
- 0269US8617928B2Dicing/die bonding filmKAMIYA KATSUHIKO·Filed 2008·Granted Dec 31, 2013·4 cites·12 claims
- 0363US7880316B2Dicing die-bonding film and process for producing semiconductor deviceNITTO DENKO CORP·Filed 2009·Granted Feb 1, 2011·3 cites·5 claims
- 0457US2014213716A1Pressure-sensitive adhesive composition and pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 0550US2012157593A1Pressure-sensitive adhesive composition and use thereofOOTAKE HIRONAO·Filed 2011·Application pending·0 cites
- 0650US2012114930A1Pressure-sensitive adhesive sheetYAMAMOTO KENICHI·Filed 2011·Application pending·0 cites
- 0748US11236254B2SeparatorNITTO DENKO CORP·Filed 2017·Granted Feb 1, 2022·0 cites·5 claims
- 0847US2010129989A1Dicing die-bonding film and process for producing semiconductor deviceNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 0947US2010129987A1Dicing die-bonding film and process for producing semiconductor deviceNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 1047US2010129986A1Dicing die-bonding film and process for producing semiconductor deviceNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 1146US2013323498A1Pressure-sensitive adhesive composition and pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 1245US2012277368A1Aqueous dispersion pressure-sensitive adhesive composition and pressure-sensitive adhesive sheetKOSO MASATSUGU·Filed 2012·Application pending·0 cites
- 1344US2010028687A1Dicing die-bonding filmKAMIYA KATSUHIKO·Filed 2009·Application pending·0 cites
- 1444US2010029061A1Dicing die-bonding filmKAMIYA KATSUHIKO·Filed 2009·Application pending·0 cites
- 1544US2010129988A1Dicing die-bonding film and process for producing semiconductor deviceNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 1639US2019194507A1Water-dispersed acrylic adhesive compositionNITTO DENKO CORP·Filed 2017·Application pending·0 cites
- 1739US2020270483A1Pressure-bonding pressure-sensitive adhesive memberNITTO DENKO CORP·Filed 2017·Application pending·0 cites
- 1838US2012231267A1Double-sided pressure-sensitive adhesive sheetOOTAKE HIRONAO·Filed 2012·Application pending·0 cites
- 1933US2010279109A1Laminated film and process for producing semiconductor deviceNITTO DENKO CORP·Filed 2010·Application pending·0 cites
- 2033US2010279050A1Laminated film and process for producing semiconductor deviceNITTO DENKO CORP·Filed 2010·Application pending·0 cites
- 2133US2010279468A1Laminated film and process for producing semiconductor deviceNITTO DENKO CORP·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →