Inventor · disambiguated record
Yasuhiro Okuda
Also filed as: OKUDA YASUHIRO
30 granted patents·17 pending applications·381 citations·filing 1983–2022
96Inventor score
Files withSUMITOMO ELECTRIC INDUSTRIES21YAMAMOTO MASAMICHI5HAYASHI FUMIHIRO3MISHIMA HIDEHIKO3MITSUBISHI ELECTRIC CORP3
Top patents by PatentIndex Score
47 records- 0192US8507803B2Structure of connecting printed wiring boards, method of connecting printed wiring boards, and adhesive having anisotropic conductivityYAMAMOTO MASAMICHI·Filed 2010·Granted Aug 13, 2013·25 cites·7 claims
- 0280US6689160B1Prosthesis for blood vesselSUMITOMO ELECTRIC INDUSTRIES·Filed 2000·Granted Feb 10, 2004·53 cites·13 claims
- 0378US7586047B2Method for manufacturing patterned porous molded product or nonwoven fabric, and electric circuit componentSUMITOMO ELECTRIC INDUSTRIES·Filed 2005·Granted Sep 8, 2009·9 cites·12 claims
- 0475US8235603B2Optoelectric conversion module, method for assembling same, and optoelectric information processor using sameTAMURA MITSUAKI·Filed 2009·Granted Aug 7, 2012·7 cites·11 claims
- 0575US5591225AComposite artificial blood vesselVASCULAR CRAFT RESEARCH CENTER·Filed 1994·Granted Jan 7, 1997·97 cites·5 claims
- 0672US7976751B2Expanded porous polytetrafluoroethylene film having elastic recovery property in thickness-wise direction of the film, production process thereof, and use of the porous filmSUMITOMO ELECTRIC INDUSTRIES·Filed 2009·Granted Jul 12, 2011·7 cites·8 claims
- 0772US7887899B2Anisotropic conductive sheet, production method thereof, connection method and inspection methodSUMITOMO ELECTRIC INDUSTRIES·Filed 2006·Granted Feb 15, 2011·5 cites·6 claims
- 0872USD280270SChairOKUDA YASUHIRO·Filed 1983·Granted Aug 27, 1985·12 cites·1 claims
- 0969US6053939AArtificial blood vesselVASCULAR GRAFT RESEARCH CENTER·Filed 1997·Granted Apr 25, 2000·85 cites·14 claims
- 1067US5426609ARead only memory capable of writing data and method of writing/reading data thereforMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Jun 20, 1995·27 cites·10 claims
- 1167US2016330850A1Method for producing printed wiring boardSUMITOMO ELECTRIC INDUSTRIES·Filed 2016·Application pending·0 cites
- 1264US9226406B2Electrode connection method, electrode connection structure, conductive adhesive used therefor, and electronic deviceYAMAMOTO MASAMICHI·Filed 2010·Granted Dec 29, 2015·2 cites·13 claims
- 1364US8133412B2Anisotropic conductive filmYAMAMOTO MASAMICHI·Filed 2009·Granted Mar 13, 2012·2 cites·8 claims
- 1463US12213249B2Method for manufacturing dielectric sheet, method for manufacturing substrate for high-frequency printed wiring board, dielectric sheet, and substrate for high-frequency printed wiring boardSUMITOMO ELECTRIC INDUSTRIES·Filed 2021·Granted Jan 28, 2025·0 cites·9 claims
- 1563US8506750B2Composite structure and process for producing the sameHAYASHI FUMIHIRO·Filed 2009·Granted Aug 13, 2013·4 cites·8 claims
- 1663US8470438B2Electrode-connecting structure, conductive adhesive used for the same, and electronic apparatusYAMAMOTO MASAMICHI·Filed 2010·Granted Jun 25, 2013·2 cites·10 claims
- 1761US7667480B2Anisotropic conductive sheet, its production method, connection method and inspection methodSUMITOMO ELECTRIC INDUSTRIES·Filed 2006·Granted Feb 23, 2010·1 cites·5 claims
- 1859US2014166495A1Substrate for printed wiring board, printed wiring board, and methods for producing sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2014·Application pending·0 cites
- 1958US10307825B2Metal powder, ink, sintered body, substrate for printed circuit board, and method for manufacturing metal powderSUMITOMO ELECTRIC INDUSTRIES·Filed 2016·Granted Jun 4, 2019·0 cites·6 claims
- 2058US5187770APhotosetting resin composition and plastic clad optical fiber comprising the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 1989·Granted Feb 16, 1993·11 cites·4 claims
- 2157US8268182B2Product having through-hole and laser processing methodMISHIMA HIDEHIKO·Filed 2007·Granted Sep 18, 2012·3 cites·3 claims
- 2257USD286786SElectrostatic copierRICOH CO LTD·Filed 1983·Granted Nov 18, 1986·6 cites·1 claims
- 2356US2016330847A1Method for producing printed wiring boardSUMITOMO ELECTRIC INDUSTRIES·Filed 2016·Application pending·0 cites
- 2455US2010323147A1Anisotropic conductive filmYAMAMOTO MASAMICHI·Filed 2009·Application pending·0 cites
- 2554US7691299B2Process for production of expanded polytetrafluoroetylene productsSUMITOMO ELECTRIC INDUSTRIES·Filed 2003·Granted Apr 6, 2010·2 cites·4 claims
- 2653US7563487B2Anisotropic electrically conductive film and method of producing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2004·Granted Jul 21, 2009·6 cites·2 claims
- 2752US2007154699A1Expanded porous polytetrafluoroethylene film having elastic recovery property in thickness-wise direction of the film, production process thereof, and use of the porous filmHAYASHI FUMIHIRO·Filed 2005·Application pending·0 cites
- 2851US10096855B2Redox flow cell membraneSUMITOMO ELECTRIC INDUSTRIES·Filed 2012·Granted Oct 9, 2018·0 cites·4 claims
- 2950US9967976B2Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit boardSUMITOMO ELECTRIC INDUSTRIES·Filed 2015·Granted May 8, 2018·0 cites·10 claims
- 3050US2024422902A1Dielectric sheet, substrate for high frequency printed wiring board, and high frequency printed wiring boardSUMITOMO ELECTRIC INDUSTRIES·Filed 2022·Application pending·0 cites
- 3150US2006269754A1Stretched polytetrafluoroethylene formed article, method for production thereof, and composite articleHAYASHI FUMIHIO·Filed 2004·Application pending·0 cites
- 3249US12246292B2Micro or nano porous membrane, manufacturing method of same, porous resin membrane complex, and filter elementSUMITOMO ELECTRIC INDUSTRIES·Filed 2019·Granted Mar 11, 2025·0 cites·6 claims
- 3349US8147911B2Perforated porous resin base material and production process of porous resin base with inner wall surfaces of perforations made conductive.OKUDA YASUHIRO·Filed 2004·Granted Apr 3, 2012·5 cites·22 claims
- 3449US2012031656A1Substrate for printed wiring board, printed wiring board, and methods for producing sameOKA YOSHIO·Filed 2010·Application pending·0 cites
- 3546US2011256342A1Film adhesive and anisotropic conductive adhesiveTOSHIOKA HIDEAKI·Filed 2009·Application pending·0 cites
- 3644US2011318530A1Product having through-hole and laser processing methodMISHIMA HIDEHIKO·Filed 2011·Application pending·0 cites
- 3743US2008044637A1Microhole-Formed Stretched Porous Polytetrafluoroethylene Material and Production Process Thereof, and Abrasion Working ProcessMASUDA YASUHITO·Filed 2005·Application pending·0 cites
- 3842US2007173917A1Composite structure and process for producing the sameHAYASHI FUMIHIRO·Filed 2004·Application pending·0 cites
- 3942US2018333739A1Coating device and method of producing coated sheetSUMITOMO ELECTRIC INDUSTRIES·Filed 2016·Application pending·0 cites
- 4040US7807066B2Method of manufacturing a porous resin substrate having perforations and method of making a porous resin substrate including perforations having electrically conductive wall facesSUMITOMO ELECTRIC INDUSTRIES·Filed 2005·Granted Oct 5, 2010·0 cites·12 claims
- 4140US2009223701A1Porous resin base, method for manufacturing same, and multilayer substrateSUMITOMO ELECTRIC INDUSTRIES·Filed 2006·Application pending·0 cites
- 4240US2009081419A1Composite Porous Resin Base Material and Method for Manufacturing the SameSUMITOMO ELECTRIC INDUSTRIES·Filed 2006·Application pending·0 cites
- 4339US5638231AMagnetic recording and reproducing device having no moveable slanting postsMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Jun 10, 1997·6 cites·12 claims
- 4439US2009152246A1Method for Processing Material by Laser Ablation and Material Processed by Processing Method ThereofMISHIMA HIDEHIKO·Filed 2006·Application pending·0 cites
- 4536US5734520AMagnetic recording/reproducing apparatusMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Mar 31, 1998·4 cites·18 claims
- 4635US2007160808A1Anisotropic conductive sheetOKUDA YASUHIRO·Filed 2005·Application pending·0 cites
- 4733USD286887SElectrostatic copierRICOH CO LTD·Filed 1983·Granted Nov 25, 1986·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →