Inventor · disambiguated record
Nick Kuo
Also filed as: KUO NICK
3 granted patents·46 citations·filing 2003–2010
72Inventor score
Technology areasH10W
Files withMEGICA CORP3
Top patents by PatentIndex Score
3 records- 0190US7855461B2Chip structure with bumps and testing padsMEGICA CORP·Filed 2008·Granted Dec 21, 2010·19 cites·37 claims
- 0279US7394161B2Chip structure with pads having bumps or wirebonded wires formed thereover or used to be tested theretoMEGICA CORP·Filed 2003·Granted Jul 1, 2008·24 cites·43 claims
- 0374US7977803B2Chip structure with bumps and testing padsMEGICA CORP·Filed 2010·Granted Jul 12, 2011·3 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →