Inventor · disambiguated record
Ernest N. Levine
Also filed as: LEVINE ERNEST · LEVINE ERNEST N · LEVINE ERNEST NORMAN
17 granted patents·3 pending applications·532 citations·filing 1979–2005
95Inventor score
Top patents by PatentIndex Score
20 records- 0192US6335151B1Micro-surface fabrication processIBM·Filed 1999·Granted Jan 1, 2002·96 cites·11 claims
- 0292US6252295B1Adhesion of silicon carbide filmsIBM·Filed 2000·Granted Jun 26, 2001·67 cites·14 claims
- 0390US5834829AEnergy relieving crack stopIBM·Filed 1996·Granted Nov 10, 1998·140 cites·30 claims
- 0482US6972209B2Stacked via-stud with improved reliability in copper metallurgyIBM·Filed 2002·Granted Dec 6, 2005·32 cites·8 claims
- 0575US6199269B1Manipulation of micromechanical objectsIBM·Filed 1997·Granted Mar 13, 2001·41 cites·18 claims
- 0670US6228744B1Manufacturing methods and uses for micro pipe systemsIBM·Filed 1999·Granted May 8, 2001·31 cites·12 claims
- 0770US6174814B1Method for producing a crack stop for interlevel dielectric layersIBM·Filed 2000·Granted Jan 16, 2001·15 cites·17 claims
- 0869US6091131AIntegrated circuit having crack stop for interlevel dielectric layersIBM·Filed 1998·Granted Jul 18, 2000·33 cites·14 claims
- 0967US5846884AMethods for metal etching with reduced sidewall build up during integrated circuit manufacturingSIEMENS AG·Filed 1997·Granted Dec 8, 1998·34 cites·21 claims
- 1064US6031286ASemiconductor structures containing a micro pipe system thereinIBM·Filed 1997·Granted Feb 29, 2000·25 cites·8 claims
- 1146US2006014376A1Stacked via-stud with improved reliability in copper metallurgyIBM·Filed 2005·Application pending·0 cites
- 1240US7034400B2Dual damascene interconnect structure using low stress fluorosilicate insulator with copper conductorsIBM·Filed 2003·Granted Apr 25, 2006·0 cites·12 claims
- 1335US4256949AMethod and wire for submerged arc welding of pipeUNION CARBIDE CORP·Filed 1979·Granted Mar 17, 1981·4 cites·7 claims
- 1434US4611746AProcess for forming improved solder connections for semiconductor devices with enhanced fatigue lifeIBM·Filed 1984·Granted Sep 16, 1986·5 cites·6 claims
- 1532US2002017726A1Metal deposition process for metal lines over topographyFiled 2000·Application pending·0 cites
- 1631US6177348B1Low temperature via fill using liquid phase transportIBM·Filed 1998·Granted Jan 23, 2001·2 cites·24 claims
- 1730US6098788ACasting of complex micromechanical objectsIBM·Filed 1997·Granted Aug 8, 2000·0 cites·9 claims
- 1830US6083823AMetal deposition process for metal lines over topographyIBM·Filed 1996·Granted Jul 4, 2000·3 cites·12 claims
- 1930US5747802AAutomated non-visual method of locating periodically arranged sub-micron objectsSIEMENS AG·Filed 1996·Granted May 5, 1998·4 cites·20 claims
- 2029US2002076917A1Dual damascene interconnect structure using low stress flourosilicate insulator with copper conductorsFiled 1999·Application pending·0 cites
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