Inventor · disambiguated record
Daizo Kamiyama
Also filed as: KAMIYAMA DAIZO
2 granted patents·2 pending applications·10 citations·filing 2007–2013
52Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0178US8030760B2Semiconductor apparatus and manufacturing method thereofTOYOTA JIDOSHOKKI KK·Filed 2007·Granted Oct 4, 2011·9 cites·18 claims
- 0253US9646915B2Heat dissipation device and semiconductor deviceTOYOTA JIDOSHOKKI KK·Filed 2013·Granted May 9, 2017·1 cites·12 claims
- 0340US2015076685A1Flow path member, and heat exchanger and semiconductor device using the sameKYOCERA CORP·Filed 2013·Application pending·0 cites
- 0436US2014332950A1Semiconductor deviceTOYOTA JIDOSHIOKKI KK·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →