Inventor · disambiguated record
Martin Weiser
Also filed as: WEISER MARTIN · WEISER MARTIN W · WEISER MARTIN WILLIAM
19 granted patents·16 pending applications·199 citations·filing 1978–2018
94Inventor score
Top patents by PatentIndex Score
35 records- 0191US4273476AReinforcement of armored earth work constructionsBAYER AG·Filed 1978·Granted Jun 16, 1981·50 cites·18 claims
- 0288US7521286B2Methods of refining lead-containing materialsHONEYWELL INT INC·Filed 2006·Granted Apr 21, 2009·6 cites·7 claims
- 0388US7118449B1Method of manufacturing an optical elementZEISS CARL SMT AG·Filed 2004·Granted Oct 10, 2006·33 cites·19 claims
- 0486US10151922B2Wavefront correction element for use in an optical systemZEISS CARL SMT GMBH·Filed 2017·Granted Dec 11, 2018·3 cites·18 claims
- 0582US8976927B2Substrate for mirrors for EUV lithographyZEISS CARL SMT GMBH·Filed 2013·Granted Mar 10, 2015·6 cites·20 claims
- 0682US7481543B1Mirror for use in a projection exposure apparatusZEISS CARL SMT AG·Filed 2006·Granted Jan 27, 2009·8 cites·10 claims
- 0778US4367568AAnchorage devices for a tension wire bundle of tension wiresSTRABAG BAU AG·Filed 1981·Granted Jan 11, 1983·31 cites·19 claims
- 0864US4443132AAnchoring of tension membersBAYER AG·Filed 1982·Granted Apr 17, 1984·11 cites·2 claims
- 0962US5044205AMethod for monitoring deformations with light waveguidesSTRABAG BAU AG·Filed 1990·Granted Sep 3, 1991·27 cites·9 claims
- 1061US7077533B2Reflecting device for electromagnetic wavesZEISS CARL SMT AG·Filed 2002·Granted Jul 18, 2006·6 cites·11 claims
- 1160US7919004B2Removing reflective layers from EUV mirrorsZEISS CARL SMT GMBH·Filed 2009·Granted Apr 5, 2011·3 cites·24 claims
- 1260US7031428B2Substrate material for X-ray optical componentsSCHOTT AG·Filed 2004·Granted Apr 18, 2006·6 cites·28 claims
- 1356US6842294B2Catadioptric objectiveZEISS CARL SMT AG·Filed 2002·Granted Jan 11, 2005·5 cites·2 claims
- 1451US8163632B2Irradiation with high energy ions for surface structuring and treatment of surface proximal sections of optical elementsWEISER MARTIN·Filed 2007·Granted Apr 24, 2012·0 cites·50 claims
- 1550US9666547B2Method of refining solder materialsWEISER MARTIN W·Filed 2010·Granted May 30, 2017·0 cites·20 claims
- 1648US2004065954A1Semiconductor packages; lead-containing solders and anodes; and methods of removing alpha-emitters from materialsFiled 2003·Application pending·0 cites
- 1746US2007045839A1Lead-containing solder pasteWEISER MARTIN W·Filed 2006·Application pending·0 cites
- 1846US2007045842A1Lead-containing solder bumpsWEISER MARTIN W·Filed 2006·Application pending·0 cites
- 1946US2007045838A1Lead-containing anodesWEISER MARTIN W·Filed 2006·Application pending·0 cites
- 2045US8466047B2Irradiation with high energy ions for surface structuring and treatment of surface proximal sections of optical elementsWEISER MARTIN·Filed 2012·Granted Jun 18, 2013·0 cites·19 claims
- 2144US10551747B2Device for changing a surface shape of an optical element via electron irradiationZEISS CARL SMT GMBH·Filed 2018·Granted Feb 4, 2020·0 cites·20 claims
- 2244US2014307308A1Reflective Optical Element for the EUV Wavelength Range, Method for Producing and for Correcting Such an Element, Projection Lens for Microlithography Comprising Such an Element, and Projection Exposure Apparatus for Microlithography Comprising Such a Projection LensZEISS CARL SMT GMBH·Filed 2014·Application pending·0 cites
- 2340US2008026181A1Synergistically-modified surfaces and surface profiles for use with thermal interconnect and interface materials, methods of production and uses thereofRASTOGI RAVI·Filed 2006·Application pending·0 cites
- 2440US2005040369A1Thermal interface materials; and compositions comprising indium and zincFiled 2002·Application pending·0 cites
- 2539US9179176B2Method for operating a data receiver and data receiver, in particular in a vehicleHEHN THORSTEN·Filed 2012·Granted Nov 3, 2015·0 cites·10 claims
- 2639US2012212721A1Substrates and mirrors for euv microlithography, and methods for producing themCLAUSS WILFRIED·Filed 2012·Application pending·0 cites
- 2738US2011038124A1Thermal interconnect and interface materials, methods of production and uses thereofHONEYWELL INT INC·Filed 2009·Application pending·0 cites
- 2838US2008118761A1Modified solder alloys for electrical interconnects, methods of production and uses thereofWEISER MARTIN W·Filed 2007·Application pending·0 cites
- 2938US2007013054A1Thermally conductive materials, solder preform constructions, assemblies and semiconductor packagesRUCHERT BRIAN D·Filed 2005·Application pending·0 cites
- 3036US2007138442A1Modified and doped solder alloys for electrical interconnects, methods of production and uses thereofWEISER MARTIN W·Filed 2006·Application pending·0 cites
- 3135US2006113683A1Doped alloys for electrical interconnects, methods of production and uses thereofDEAN NANCY·Filed 2005·Application pending·0 cites
- 3235US2008291634A1Thermal interconnect and interface materials, methods of production and uses thereofWEISER MARTIN W·Filed 2008·Application pending·0 cites
- 3334US2005000821A1Anodes for electroplating operations, and methods of forming materials over semiconductor substratesFiled 2001·Application pending·0 cites
- 3434US2008023665A1Thermal interconnect and interface materials, methods of production and uses thereofWEISER MARTIN W·Filed 2006·Application pending·0 cites
- 3532US4501516AAnchoring of tension membersBAYER AG·Filed 1983·Granted Feb 26, 1985·4 cites·2 claims
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