Inventor · disambiguated record
Yung-Chieh Kuo
Also filed as: KUO YUNG-CHIEH
5 granted patents·6 pending applications·45 citations·filing 1998–2023
78Inventor score
Top patents by PatentIndex Score
11 records- 0171US6913520B1All-in-one polishing process for a semiconductor waferUNITED MICROELECTRONICS CORP·Filed 2004·Granted Jul 5, 2005·20 cites·22 claims
- 0269US9378968B2Method for planarizing semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2014·Granted Jun 28, 2016·2 cites·9 claims
- 0353US2025149359A1Controlling method for semiconductor process auxiliary apparatus, control assembly and manufacturing systemUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 0448US8222143B2Reworking method for integrated circuit devicesLIU YAN-HOME·Filed 2007·Granted Jul 17, 2012·1 cites·19 claims
- 0546US6319826B1Method of fabricating barrier layerUNITED MICROELECTRONICS CORP·Filed 1999·Granted Nov 20, 2001·15 cites·20 claims
- 0644US2007060028A1Cmp slurry delivery system and method of mixing slurry thereofCHEN SHENG-YU·Filed 2006·Application pending·0 cites
- 0744US2007232069A1Chemical mechanical polishing apparatusUNITED MICROELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 0840US2006191871A1Cmp slurry delivery system and method of mixing slurry thereofCHEN SHENG-YU·Filed 2005·Application pending·0 cites
- 0938US6074941AMethod of forming a via with plasma treatment of SOGUNITED SEMICONDUCTOR CORP·Filed 1998·Granted Jun 13, 2000·7 cites·14 claims
- 1037US2007072426A1Chemical mechanical polishing process and apparatus thereforTSENG TZU-YU·Filed 2005·Application pending·0 cites
- 1131US2007082490A1Apparatus of chemical mechanical polishing and chemical mechanical polishing processHU CHUN-TING·Filed 2005·Application pending·0 cites
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