Inventor · disambiguated record
Takayoshi Matsumura
Also filed as: MATSUMURA TAKAYOSHI
42 granted patents·29 pending applications·367 citations·filing 1984–2020
97Inventor score
Files withFUJITSU LTD60MATSUMURA TAKAYOSHI3MATSUSHITA ELECTRIC INDUSTRIAL CO LTD2ISHIKAWA NAOKI1KOBAYASHI HIROSHI1
Top patents by PatentIndex Score
71 records- 0196US8698633B2RFID tag manufacturing method with strap and substrateKOBAYASHI HIROSHI·Filed 2011·Granted Apr 15, 2014·28 cites·2 claims
- 0296US4828392AExposure apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1986·Granted May 9, 1989·127 cites·15 claims
- 0395US7954228B2RFID tag manufacturing method with strap and substrateFUJITSU LTD·Filed 2007·Granted Jun 7, 2011·35 cites·4 claims
- 0494US7936273B2RFID tag manufacturing methods and RFID tagsFUJITSU LTD·Filed 2006·Granted May 3, 2011·35 cites·9 claims
- 0593US11032940B2Cooling plate, cooling device, and electronic apparatusFUJITSU LTD·Filed 2020·Granted Jun 8, 2021·3 cites·6 claims
- 0691US9740976B2RFID tag and manufacturing method thereofFUJITSU LTD·Filed 2016·Granted Aug 22, 2017·10 cites·24 claims
- 0790US10443957B2Cooling plate and information processing deviceFUJITSU LTD·Filed 2018·Granted Oct 15, 2019·7 cites·10 claims
- 0890US7471081B2Slider testerFUJITSU LTD·Filed 2006·Granted Dec 30, 2008·8 cites·1 claims
- 0988US7523775B2Bonding apparatus and method of bonding for a semiconductor chipFUJITSU LTD·Filed 2006·Granted Apr 28, 2009·15 cites·5 claims
- 1088US7514788B2Structure of mounting electronic componentFUJITSU LTD·Filed 2007·Granted Apr 7, 2009·13 cites·1 claims
- 1186US8973832B2RFID tag and RFID systemFUJITSU LTD·Filed 2013·Granted Mar 10, 2015·8 cites·10 claims
- 1285US10032104B2RFID tagFUJITSU LTD·Filed 2017·Granted Jul 24, 2018·4 cites·20 claims
- 1385US9798970B2Radio frequency identification tagFUJITSU LTD·Filed 2016·Granted Oct 24, 2017·4 cites·14 claims
- 1485US7424966B2Method of ultrasonic mounting and ultrasonic mounting apparatus using the sameFUJITSU LTD·Filed 2005·Granted Sep 16, 2008·7 cites·4 claims
- 1583US9972884B2RFID tagFUJITSU LTD·Filed 2016·Granted May 15, 2018·4 cites·12 claims
- 1679US10629556B2Composite bump, method for forming composite bump, and substrateFUJITSU LTD·Filed 2018·Granted Apr 21, 2020·2 cites·11 claims
- 1775US4636077AAligning exposure methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1984·Granted Jan 13, 1987·21 cites·28 claims
- 1873US7562434B2Method of assembling a carriage assemblyFUJITSU LTD·Filed 2006·Granted Jul 21, 2009·6 cites·3 claims
- 1973US7355285B2Structure of mounting electronic componentFUJITSU LTD·Filed 2005·Granted Apr 8, 2008·4 cites·3 claims
- 2070US10591690B2Optical module and method of manufacturing the sameFUJITSU LTD·Filed 2018·Granted Mar 17, 2020·1 cites·8 claims
- 2170US7350685B2Method of mounting electronic componentFUJITSU LTD·Filed 2005·Granted Apr 1, 2008·2 cites·7 claims
- 2269US7506427B2Method of assembling a carriage assemblyFUJITSU LTD·Filed 2006·Granted Mar 24, 2009·1 cites·5 claims
- 2369US7208059B2Method of ultrasonic-mounting electronic component and ultrasonic mounting machineFUJITSU LTD·Filed 2005·Granted Apr 24, 2007·4 cites·6 claims
- 2468US9590307B2Antenna apparatusFUJITSU LTD·Filed 2015·Granted Mar 7, 2017·2 cites·23 claims
- 2567US9111192B2RFID tagFUJITSU LTD·Filed 2013·Granted Aug 18, 2015·2 cites·9 claims
- 2666US8308071B2RFID tag and manufacturing method thereofTAKEUCHI SHUICHI·Filed 2010·Granted Nov 13, 2012·2 cites·6 claims
- 2766US8169075B2Electronic part with affixed MEMSTAKAHASHI TETSUYA·Filed 2009·Granted May 1, 2012·3 cites·3 claims
- 2864US7581309B2Method of assembling a carriage assemblyFUJITSU LTD·Filed 2006·Granted Sep 1, 2009·3 cites·2 claims
- 2963US2009146653A1Slider testerFUJITSU LTD·Filed 2008·Application pending·0 cites
- 3059US10634438B2Cooling plate and information processing deviceFUJITSU LTD·Filed 2019·Granted Apr 28, 2020·0 cites·16 claims
- 3159US2008265002A1Method of ultrasonic mounting and ultrasonic mounting apparatus using the sameFUJITSU LTD·Filed 2007·Application pending·0 cites
- 3259US2008265003A1Method of ultrasonic mounting and ultrasonic mounting apparatus using the sameFUJITSU LTD·Filed 2007·Application pending·0 cites
- 3358US7712650B2Method of mounting a semiconductor chipFUJITSU LTD·Filed 2006·Granted May 11, 2010·1 cites·5 claims
- 3457US10996403B2Optical fiber mounting method and optical moduleFUJITSU LTD·Filed 2020·Granted May 4, 2021·0 cites·5 claims
- 3554US10586770B2Optical moduleFUJITSU LTD·Filed 2018·Granted Mar 10, 2020·0 cites·10 claims
- 3654US10444450B2Optical moduleFUJITSU LTD·Filed 2018·Granted Oct 15, 2019·0 cites·9 claims
- 3753US7150388B2Method of bonding and bonding apparatus for a semiconductor chipFUJITSU LTD·Filed 2004·Granted Dec 19, 2006·5 cites·5 claims
- 3853US2008225433A1Method and apparatus for assembling a carriage assemblyFUJITSU LTD·Filed 2008·Application pending·0 cites
- 3952US2009152327A1Wire bonding methodFUJITSU LTD·Filed 2008·Application pending·0 cites
- 4051US7507654B2Method for mounting electronic element on a circuit boardFUJITSU LTD·Filed 2006·Granted Mar 24, 2009·0 cites·5 claims
- 4150US9477920B2RFID tagFUJITSU LTD·Filed 2015·Granted Oct 25, 2016·0 cites·13 claims
- 4250US2010095515A1Method and apparatus for assembling a carriage assemblyTOSHIBA STORAGE DEVICE CORP·Filed 2007·Application pending·0 cites
- 4350US2008072643A1Ultrasonic crimping apparatus, crimping member, ultrasonic crimping method and arm production methodFUJITSU LTD·Filed 2007·Application pending·0 cites
- 4449US2013249087A1Electronic component and manufacture method thereofFUJITSU LTD·Filed 2013·Application pending·0 cites
- 4547US10210720B2Electronic equipment and beaconFUJITSU LTD·Filed 2017·Granted Feb 19, 2019·0 cites·12 claims
- 4647US2007180673A1Method of assembling a carriage assemblyFUJITSU LTD·Filed 2006·Application pending·0 cites
- 4746US9208425B2RFID tagFUJITSU LTD·Filed 2014·Granted Dec 8, 2015·0 cites·17 claims
- 4846US2010126763A1Wire bonding method, electronic apparatus, and method of manufacturing sameFUJITSU LTD·Filed 2009·Application pending·0 cites
- 4946US2006030076A1Semiconductor deviceFUJITSU LTD·Filed 2005·Application pending·0 cites
- 5046US2006097029A1Method of flip-chip bondingFUJITSU LTD·Filed 2005·Application pending·0 cites
Showing the top 50 of 71 patent records by PatentIndex Score.
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