Inventor · disambiguated record
Shinya Takyu
Also filed as: TAKYU SHINYA
26 granted patents·7 pending applications·868 citations·filing 1998–2015
97Inventor score
Top patents by PatentIndex Score
33 records- 0194US6294439B1Method of dividing a wafer and method of manufacturing a semiconductor deviceTOSHIBA KK·Filed 2000·Granted Sep 25, 2001·139 cites·26 claims
- 0294US5888883AMethod of dividing a wafer and method of manufacturing a semiconductor deviceTOSHIBA KK·Filed 1998·Granted Mar 30, 1999·221 cites·8 claims
- 0393US7060593B2Method of and mechanism for peeling adhesive tape bonded to segmented semiconductor waferTOSHIBA KK·Filed 2002·Granted Jun 13, 2006·57 cites·2 claims
- 0490US6337258B1Method of dividing a waferTOSHIBA KK·Filed 2000·Granted Jan 8, 2002·59 cites·16 claims
- 0587US6756562B1Semiconductor wafer dividing apparatus and semiconductor device manufacturing methodTOSHIBA KK·Filed 2003·Granted Jun 29, 2004·39 cites·26 claims
- 0686US7135384B2Semiconductor wafer dividing method and apparatusTOSHIBA KK·Filed 2004·Granted Nov 14, 2006·38 cites·16 claims
- 0784US7482695B2Stack MCP and manufacturing method thereofTOSHIBA KK·Filed 2007·Granted Jan 27, 2009·11 cites·4 claims
- 0884US7300818B2Method of and mechanism for peeling adhesive tape bonded to segmented semiconductor waferTOSHIBA KK·Filed 2005·Granted Nov 27, 2007·7 cites·7 claims
- 0983US6184109B1Method of dividing a wafer and method of manufacturing a semiconductor deviceTOSHIBA KK·Filed 1999·Granted Feb 6, 2001·76 cites·30 claims
- 1082US6465330B1Method for grinding a wafer backLINTEC CORP·Filed 1999·Granted Oct 15, 2002·64 cites·8 claims
- 1181US8771456B2Method of manufacturing a semiconductor device and substrate separating apparatusTOSHIBA KK·Filed 2013·Granted Jul 8, 2014·5 cites·19 claims
- 1281US6699774B2Wafer splitting method using cleavageTOSHIBA KK·Filed 2002·Granted Mar 2, 2004·24 cites·20 claims
- 1380US7932162B2Method for manufacturing a stacked semiconductor package, and stacked semiconductor packageTOSHIBA KK·Filed 2008·Granted Apr 26, 2011·7 cites·15 claims
- 1478US6774011B2Chip pickup device and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2001·Granted Aug 10, 2004·21 cites·6 claims
- 1576US7285864B2Stack MCPTOSHIBA KK·Filed 2004·Granted Oct 23, 2007·20 cites·5 claims
- 1675US9893116B2Manufacturing method of electronic device and manufacturing method of semiconductor deviceTOSHIBA MEMORY CORP·Filed 2015·Granted Feb 13, 2018·2 cites·15 claims
- 1775US7223319B2Semiconductor manufacturing apparatus and method of manufacturing semiconductor deviceLINTEC CORP·Filed 2004·Granted May 29, 2007·19 cites·14 claims
- 1869US6777313B2Semiconductor device manufacturing method for reinforcing chip by use of seal member at pickup timeTOSHIBA KK·Filed 2002·Granted Aug 17, 2004·17 cites·30 claims
- 1968US8294282B2Semiconductor device and adhesive sheetHAYASHI HIDEKAZU·Filed 2010·Granted Oct 23, 2012·3 cites·8 claims
- 2067US7060532B2Manufacturing method of semiconductor deviceLINTEC CORP·Filed 2004·Granted Jun 13, 2006·17 cites·4 claims
- 2166US6838316B2Semiconductor device manufacturing method using ultrasonic flip chip bonding techniqueTOSHIBA KK·Filed 2003·Granted Jan 4, 2005·15 cites·17 claims
- 2265US8790995B2Processing method and processing device of semiconductor wafer, and semiconductor waferTAKYU SHINYA·Filed 2012·Granted Jul 29, 2014·2 cites·14 claims
- 2364US8956917B2Semiconductor device, and manufacturing method and manufacturing apparatus of the sameKUROSAWA TETSUYA·Filed 2012·Granted Feb 17, 2015·2 cites·14 claims
- 2462US7294558B2Method and apparatus for cleaving a wafer through expansion resulting from vaporization or freezing of liquidTOSHIBA KK·Filed 2005·Granted Nov 13, 2007·1 cites·16 claims
- 2558US7833836B2Stack MCP and manufacturing method thereofTOSHIBA KK·Filed 2008·Granted Nov 16, 2010·1 cites·15 claims
- 2648US7631680B2Method of and mechanism for peeling adhesive tape bonded to segmented semiconductor waferTOSHIBA KK·Filed 2004·Granted Dec 15, 2009·1 cites·19 claims
- 2745US2008299686A1Method for manufacturing semiconductor deviceTOSHIBA KK·Filed 2007·Application pending·0 cites
- 2844US2011163459A1Method for manufacturing a stacked semiconductor package, and stacked semiconductor packageTOSHIBA KK·Filed 2011·Application pending·0 cites
- 2939US2012329369A1Substrate processing method and substrate processing apparatusSHIMIZU NORIKO·Filed 2012·Application pending·0 cites
- 3038US2005023260A1Semiconductor wafer dividing apparatus and semiconductor device manufacturing methodFiled 2004·Application pending·0 cites
- 3137US2012235282A1Semiconductor device manufacturing method and semiconductor deviceTOMONO AKIRA·Filed 2012·Application pending·0 cites
- 3236US2005026326A1Manufacturing method of semiconductor deviceFiled 2004·Application pending·0 cites
- 3333US2010311224A1Manufacturing method of semiconductor deviceTOSHIBA KK·Filed 2010·Application pending·0 cites
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