Inventor · disambiguated record
Jen-Yi Tsai
Also filed as: TSAI JEN-YI
2 granted patents·2 pending applications·70 citations·filing 2000–2010
66Inventor score
Top patents by PatentIndex Score
4 records- 0180US6359342B1Flip-chip bumping structure with dedicated test pads on semiconductor chip and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Mar 19, 2002·37 cites·10 claims
- 0278US6772512B2Method of fabricating a flip-chip ball-grid-array package without causing mold flashSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Aug 10, 2004·33 cites·6 claims
- 0337US2011278054A1Circuit board with notched conductor padsLEE I-TSENG·Filed 2010·Application pending·0 cites
- 0430US2011299259A1Circuit board with conductor post structureHSIEH YU-LING·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →