Inventor · disambiguated record
Yao-Min Liu
Also filed as: LIU YAO · LIU YAO-MIN
9 granted patents·8 pending applications·6 citations·filing 2013–2025
79Inventor score
Top patents by PatentIndex Score
17 records- 0194US11676898B2Diffusion barrier for semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 13, 2023·4 cites·16 claims
- 0285US12354958B2Semiconductor devices and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 8, 2025·1 cites·21 claims
- 0380US12237261B2Semiconductor device having a contact structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 25, 2025·0 cites·20 claims
- 0477US11996361B2Method of making a contact structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 28, 2024·0 cites·20 claims
- 0577US2025183161A1Method of making semiconductor device having a contact structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0672US11652044B2Contact structure and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 16, 2023·0 cites·20 claims
- 0772US2024387381A1Semiconductor devices and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0872US2024387256A1Ruthenium-based liner for a copper interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0970US2025259889A1Interconnect Structure of Semiconductor DeviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1068US9156947B2Organic semiconductor material and thin-film transistorAU OPTRONICS CORP·Filed 2013·Granted Oct 13, 2015·1 cites·4 claims
- 1167US12322649B2Interconnect structure of semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 3, 2025·0 cites·20 claims
- 1266US12094770B2Ruthenium-based liner for a copper interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 17, 2024·0 cites·20 claims
- 1364US2022367376A1Diffusion Barrier for Semiconductor Device and MethodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1455US11527476B2Interconnect structure of semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 13, 2022·0 cites·20 claims
- 1554US2024272137A1Structural-profiling of analytes by nanopore trappingNANJING UNIVERSITY·Filed 2022·Application pending·0 cites
- 1654US2024418701A1Single molecule identification with a reactive hetero-nanoporeNANJING UNIVERSITY·Filed 2022·Application pending·0 cites
- 1750US2023042277A1Semiconductor processing tool and method for passivation layer formation and removalTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →