Inventor · disambiguated record
Phillip Celaya
Also filed as: CELAYA PHILLIP · CELAYA PHILLIP C
29 granted patents·4 pending applications·614 citations·filing 1991–2024
97Inventor score
Files withSEMICONDUCTOR COMPONENTS IND16SEMICONDUCTOR COMPONENTS IND LLC8CELAYA PHILLIP3MOTOROLA INC3CARNEY FRANCIS J1
Top patents by PatentIndex Score
33 records- 0192US5895229AMicroelectronic package including a polymer encapsulated die, and method for forming sameMOTOROLA INC·Filed 1997·Granted Apr 20, 1999·128 cites·11 claims
- 0291US6093972AMicroelectronic package including a polymer encapsulated dieMOTOROLA INC·Filed 1999·Granted Jul 25, 2000·125 cites·5 claims
- 0389US9899349B2Semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Feb 20, 2018·6 cites·15 claims
- 0488US8071427B2Method for manufacturing a semiconductor component and structure thereforCELAYA PHILLIP·Filed 2009·Granted Dec 6, 2011·18 cites·14 claims
- 0588US5808873AElectronic component assembly having an encapsulation material and method of forming the sameMOTOROLA INC·Filed 1997·Granted Sep 15, 1998·135 cites·14 claims
- 0687US10304798B2Semiconductor packages with leadframes and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted May 28, 2019·4 cites·13 claims
- 0787USD510728SSemiconductor device packageSEMICONDUCTOR COMPONENTS IND·Filed 2004·Granted Oct 18, 2005·34 cites·1 claims
- 0886USD504874SSemiconductor device packageSEMICONDUCTOR COMPONENTS IND·Filed 2004·Granted May 10, 2005·32 cites·1 claims
- 0985US7495323B2Semiconductor package structure having multiple heat dissipation paths and method of manufactureSEMICONDUCTOR COMPONENTS IND·Filed 2006·Granted Feb 24, 2009·14 cites·18 claims
- 1084US6889429B2Method of making a lead-free integrated circuit packageSEMICONDUCTOR COMPONENTS IND·Filed 2001·Granted May 10, 2005·37 cites·16 claims
- 1176US9379048B2Dual-flag stacked die packageSEMICONDUCTOR COMPONENTS IND·Filed 2013·Granted Jun 28, 2016·4 cites·17 claims
- 1268US8581416B2Method of forming a semiconductor device and leadframe thereforMASSIE HAROLD L·Filed 2011·Granted Nov 12, 2013·4 cites·20 claims
- 1368US7638863B2Semiconductor package and method thereforSEMICONDUCTOR COMPONENTS IND·Filed 2006·Granted Dec 29, 2009·3 cites·14 claims
- 1468US7202105B2Multi-chip semiconductor connector assembly methodSEMICONDUCTOR COMPONENTS IND·Filed 2004·Granted Apr 10, 2007·12 cites·20 claims
- 1567US7298034B2Multi-chip semiconductor connector assembliesSEMICONDUCTOR COMPONENTS IND·Filed 2004·Granted Nov 20, 2007·12 cites·6 claims
- 1665US7875964B2Multi-chip semiconductor connector and methodSEMICONDUCTOR COMPONENTS IND·Filed 2007·Granted Jan 25, 2011·2 cites·9 claims
- 1765US5085839AApparatus for the prevention of acid gas excursionsLYONDELL PETROCHEM·Filed 1991·Granted Feb 4, 1992·33 cites·16 claims
- 1861US7508060B2Multi-chip semiconductor connector assembliesSEMICONDUCTOR COMPONENTS IND·Filed 2007·Granted Mar 24, 2009·2 cites·13 claims
- 1961US7180170B2Lead-free integrated circuit package structureSEMICONDUCTOR COMPONENTS IND·Filed 2005·Granted Feb 20, 2007·2 cites·19 claims
- 2060US11049843B2Semiconductor packagesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Jun 29, 2021·0 cites·20 claims
- 2160US8324026B2Method for manufacturing a semiconductor componentCELAYA PHILLIP·Filed 2011·Granted Dec 4, 2012·1 cites·15 claims
- 2259US11557530B2Semiconductor devices and methods of making the sameSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Jan 17, 2023·0 cites·20 claims
- 2358US8461670B2Semiconductor component and method of manufactureCELAYA PHILLIP·Filed 2010·Granted Jun 11, 2013·3 cites·20 claims
- 2455US7825505B2Semiconductor package and method thereforSEMICONDUCTOR COMPONENTS IND·Filed 2009·Granted Nov 2, 2010·0 cites·9 claims
- 2555US2025022831A1Semiconductor packages with wettable flanks and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 2651US7202106B2Multi-chip semiconductor connector and methodSEMICONDUCTOR COMPONENTS IND·Filed 2004·Granted Apr 10, 2007·3 cites·14 claims
- 2749US7498195B2Multi-chip semiconductor connector assembly methodSEMICONDUCTOR COMPONENTS IND·Filed 2007·Granted Mar 3, 2009·0 cites·8 claims
- 2844US8253239B2Multi-chip semiconductor connectorCARNEY FRANCIS J·Filed 2010·Granted Aug 28, 2012·0 cites·4 claims
- 2942US2015035166A1Method for manufacturing a semiconductor component and structureSEMICONDUCTOR COMPONENTS IND·Filed 2014·Application pending·0 cites
- 3041US10727170B2Semiconductor devices and methods of making the sameSEMICONDUCTOR COMPONENTS IND LLC·Filed 2015·Granted Jul 28, 2020·0 cites·20 claims
- 3140US2014151883A1Method for manufacturing a semiconductor component and structure thereforSEMICONDUCTOR COMPONENTS IND·Filed 2012·Application pending·0 cites
- 3238US9620443B2Semiconductor component and method of manufactureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Apr 11, 2017·0 cites·20 claims
- 3329US2018090421A1Long-lasting wettable flanksSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →