Inventor · disambiguated record
Naoki Komai
Also filed as: KOMAI NAOKI
29 granted patents·22 pending applications·404 citations·filing 1999–2024
96Inventor score
Files withSONY CORP27SONY SEMICONDUCTOR SOLUTIONS CORP8ISHIDA SEISAKUSHO3KAGAWA YOSHIHISA1KOMAI NAOKI1
Top patents by PatentIndex Score
51 records- 0197US6846227B2Electro-chemical machining appartusSONY CORP·Filed 2002·Granted Jan 25, 2005·81 cites·20 claims
- 0292US8034704B2Method for manufacturing semiconductor device and semiconductor deviceSONY CORP·Filed 2007·Granted Oct 11, 2011·27 cites·7 claims
- 0389US6479384B2Process for fabricating a semiconductor deviceSONY CORP·Filed 2001·Granted Nov 12, 2002·47 cites·18 claims
- 0486US11614606B2Camera module, method of manufacturing the same, and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2018·Granted Mar 28, 2023·2 cites·22 claims
- 0586US6534117B1Electroless plating method and electroless plating solutionSONY CORP·Filed 2000·Granted Mar 18, 2003·32 cites·8 claims
- 0685US6797623B2Methods of producing and polishing semiconductor device and polishing apparatusSONY CORP·Filed 2001·Granted Sep 28, 2004·30 cites·26 claims
- 0783US9379006B2Semiconductor apparatus, electronic device, and method of manufacturing semiconductor apparatusSONY CORP·Filed 2014·Granted Jun 28, 2016·5 cites·18 claims
- 0882US6380065B1Interconnection structure and fabrication process thereforSONY CORP·Filed 1999·Granted Apr 30, 2002·69 cites·8 claims
- 0979US8664763B2Semiconductor apparatus, electronic device, and method of manufacturing semiconductor apparatusKAGAWA YOSHIHISA·Filed 2012·Granted Mar 4, 2014·4 cites·8 claims
- 1078US12030684B2Packaging apparatusISHIDA SEISAKUSHO·Filed 2022·Granted Jul 9, 2024·1 cites·6 claims
- 1178US10986281B2Pinhole camera, electronic apparatus and manufacturing methodSONY CORP·Filed 2016·Granted Apr 20, 2021·2 cites·32 claims
- 1277US6709979B2Method of manufacturing a semiconductor deviceSONY CORP·Filed 2001·Granted Mar 23, 2004·21 cites·4 claims
- 1376US2025142988A1Backside-illumination solid-state image pickup apparatus, image pickup apparatus, and electronic equipment including embedment membersSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2024·Application pending·0 cites
- 1475US6809029B2Semiconductor production device and production method for semiconductor deviceSONY CORP·Filed 2001·Granted Oct 26, 2004·14 cites·11 claims
- 1574US6878632B2Semiconductor device having a conductive layer with a cobalt tungsten phosphorus coating and a manufacturing method thereofSONY CORP·Filed 2001·Granted Apr 12, 2005·17 cites·5 claims
- 1673US7186322B2Methods of producing and polishing semiconductor device and polishing apparatusSONY CORP·Filed 2002·Granted Mar 6, 2007·14 cites·42 claims
- 1773US6524429B1Method of forming buried wiring, and apparatus for processing substratumSONY CORP·Filed 2000·Granted Feb 25, 2003·14 cites·10 claims
- 1870US11924557B2Pinhole camera, electronic apparatus and manufacturing methodSONY CORP·Filed 2021·Granted Mar 5, 2024·0 cites·23 claims
- 1968US2022157873A1Semiconductor device, method of manufacturing semiconductor device, and electronic apparatusSONY GROUP CORP·Filed 2022·Application pending·0 cites
- 2066US7851236B2Film thickness prediction method, layout design method, mask pattern design method of exposure mask, and fabrication method of semiconductor integrated circuitSONY CORP·Filed 2009·Granted Dec 14, 2010·2 cites·11 claims
- 2164US6602787B2Method for fabricating semiconductor devicesSONY CORP·Filed 2001·Granted Aug 5, 2003·9 cites·12 claims
- 2263US12349482B2Backside illumination type solid-state imaging device, manufacturing method for backside illumination type solid-state imaging device, imaging apparatus and electronic equipmentSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2018·Granted Jul 1, 2025·0 cites·22 claims
- 2363US10195872B2Label printerISHIDA SEISAKUSHO·Filed 2016·Granted Feb 5, 2019·1 cites·26 claims
- 2460US12230662B2Backside-illumination solid-state image pickup apparatus, image pickup apparatus, and electronic equipment including embedment membersSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2019·Granted Feb 18, 2025·0 cites·32 claims
- 2560US2022310680A1Backside illumination type solid-state imaging device, manufacturing method for backside illumination type solid-state imaging device, imaging apparatus and electronic equipmentSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Application pending·0 cites
- 2658US6736699B2Electrolytic polishing apparatus, electrolytic polishing method and wafer subject to polishingSONY CORP·Filed 2001·Granted May 18, 2004·5 cites·7 claims
- 2757US2025366251A1Photodetection element and method of manufacturing photodetection elementSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2023·Application pending·0 cites
- 2856US6465342B1Semiconductor device and its manufacturing methodSONY CORP·Filed 2000·Granted Oct 15, 2002·7 cites·13 claims
- 2955US2016284753A1Semiconductor device, method of manufacturing semiconductor device, and electronic apparatusSONY CORP·Filed 2014·Application pending·0 cites
- 3052US2024170511A1Semiconductor chip and manufacturing method therefor, semiconductor device and manufacturing method therefor, and electronic deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Application pending·0 cites
- 3151US2017263665A1Semiconductor device, method of manufacturing semiconductor device, and electronic apparatusSONY CORP·Filed 2017·Application pending·0 cites
- 3250US2007051638A1Electropolishing liquid, electropolishing method, and method for fabricating semiconductor deviceSONY CORP·Filed 2006·Application pending·0 cites
- 3343US7033943B2Etching solution, etching method and method for manufacturing semiconductor deviceSONY CORP·Filed 2004·Granted Apr 25, 2006·0 cites·4 claims
- 3443US2004159553A1Semiconductor manufacturing apparatus and method for manufacturing semiconductor devicesFiled 2004·Application pending·0 cites
- 3542US6777321B2Method of forming buried wiringSONY CORP·Filed 2002·Granted Aug 17, 2004·0 cites·10 claims
- 3642US2005082165A1Electro-chemical machining apparatusFiled 2004·Application pending·0 cites
- 3742US2004188273A1Electrolytic polishing apparatus, electrolytic polishing method, and wafer subject to polishingFiled 2004·Application pending·0 cites
- 3841US2004188244A1Electro-chemical machining apparatusFiled 2004·Application pending·0 cites
- 3941US2006163739A1Semiconductor device and method for production thereofKOMAI NAOKI·Filed 2005·Application pending·0 cites
- 4041US2004159557A1Electrolytic polishing liquid, electrolytic polishing method and method for fabricating semiconductor deviceFiled 2003·Application pending·0 cites
- 4140US12119366B2Solid state imaging device, solid state imaging device manufacturing method, and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2017·Granted Oct 15, 2024·0 cites·19 claims
- 4240US2006019485A1Multi-layer wiring structure, semiconductor apparatus having multi-layer wiring structure, and methods of manufacturing themSONY CORP·Filed 2005·Application pending·0 cites
- 4339US7141501B2Polishing method, polishing apparatus, and method of manufacturing semiconductor deviceSONY CORP·Filed 2003·Granted Nov 28, 2006·0 cites·2 claims
- 4438US2005014359A1Semiconductor device manufacturing methodFiled 2003·Application pending·0 cites
- 4538US2004259365A1Polishing method polishing system and method for fabricating semiconductor deviceFiled 2003·Application pending·0 cites
- 4638US2005121335A1Electropolishing apparatus, electropolishing method, and method of manufacturing semiconductor deviceSONY CORP·Filed 2003·Application pending·0 cites
- 4737US2004149592A1Electropolishing apparatus and polishing methodSONY CORP·Filed 2004·Application pending·0 cites
- 4837US2005178672A1Polishing method, polishing device, and method of manufacturing semiconductor equipmentFiled 2003·Application pending·0 cites
- 4935US2002074664A1Semiconductor device and manufacturing method thereofFiled 2001·Application pending·0 cites
- 5033US10052884B2Label issuing apparatusISHIDA SEISAKUSHO·Filed 2015·Granted Aug 21, 2018·0 cites·18 claims
Showing the top 50 of 51 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →