Inventor · disambiguated record
Jyun-Ling Tsai
Also filed as: TSAI JYUN-LING
1 granted patent·3 pending applications·2 citations·filing 2014–2016
18Inventor score
Technology areasH10W
Files withSILICONWARE PRECISION INDUSTRIES CO LTD4
Top patents by PatentIndex Score
4 records- 0159US9263380B2Semiconductor interposer and package structure having the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Feb 16, 2016·2 cites·27 claims
- 0238US2017084562A1Package structure, chip structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Application pending·0 cites
- 0335US2015325545A1Package structure, chip structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
- 0430US2017311445A1Electronic package and substrate structure thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →