Inventor · disambiguated record
Bong-Ken Yu
Also filed as: YU BONG-KEN
1 granted patent·2 pending applications·11 citations·filing 2010–2023
33Inventor score
Top patents by PatentIndex Score
3 records- 0181US8552546B2Semiconductor package, semiconductor package structure including the semiconductor package, and mobile phone including the semiconductor package structureSONG IN-SANG·Filed 2010·Granted Oct 8, 2013·11 cites·19 claims
- 0245US2024096819A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0322US2017025378A1Method of bonding a bump of a semiconductor package and apparatus for performing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →