Inventor · disambiguated record
Chih-Ming Ko
Also filed as: KO CHIH-MING
3 granted patents·28 citations·filing 2010–2017
68Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0187US8115319B2Flip chip package maintaining alignment during solderingHSU HUNG-HSIN·Filed 2010·Granted Feb 14, 2012·15 cites·9 claims
- 0285US8237273B2Metal post chip connecting device and method free to use soldering materialHSU HUNG-HSIN·Filed 2010·Granted Aug 7, 2012·11 cites·10 claims
- 0365US9991206B1Package method including forming electrical paths through a mold layerPOWERTECH TECHNOLOGY INC·Filed 2017·Granted Jun 5, 2018·2 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →