Inventor · disambiguated record
Sung-Chun Hsieh
Also filed as: HSIEH SUNG CHUN
6 granted patents·90 citations·filing 1998–2004
83Inventor score
Files withWORLDWIDE SEMICONDUCTOR MFG2MOSEL VITELIC INC1TAIWAN SEMICONDUCTOR MFG1TAIWAN SEMICONDUCTOR MFG CORP1WORLDWIDE SEMICONDUCTOR MANUFA1
Top patents by PatentIndex Score
6 records- 0174US6150235AMethod of forming shallow trench isolation structuresWORLDWIDE SEMICONDUCTOR MFG·Filed 2000·Granted Nov 21, 2000·26 cites·16 claims
- 0266US6228753B1Method of fabricating a bonding pad structure for improving the bonding pad surface qualityWORLDWIDE SEMICONDUCTOR MFG·Filed 1999·Granted May 8, 2001·34 cites·19 claims
- 0350US7705464B2Connection structure for semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Apr 27, 2010·4 cites·34 claims
- 0446US6396751B1Semiconductor device comprising a test structureTAIWAN SEMICONDUCTOR MFG CORP·Filed 2001·Granted May 28, 2002·6 cites·9 claims
- 0543US6022800AMethod of forming barrier layer for tungsten plugs in interlayer dielectricsWORLDWIDE SEMICONDUCTOR MANUFA·Filed 1998·Granted Feb 8, 2000·13 cites·10 claims
- 0634US6096645AMethod of making IC devices having stable CVD titanium nitride filmsMOSEL VITELIC INC·Filed 1998·Granted Aug 1, 2000·7 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →