Inventor · disambiguated record
Naomi Yonemura
Also filed as: YONEMURA NAOMI
4 granted patents·3 pending applications·147 citations·filing 1992–2008
80Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0180US6369332B1Metal-base multilayer circuit substrate with heat conducting adhesiveDENKI KAGAKU KOGYO KK·Filed 2000·Granted Apr 9, 2002·33 cites·13 claims
- 0279US6175084B1Metal-base multilayer circuit substrate having a heat conductive adhesive layerDENKI KAGAKU KOGYO KK·Filed 1996·Granted Jan 16, 2001·64 cites·10 claims
- 0369US5362926ACircuit substrate for mounting a semiconductor elementDENKI KAGAKU KOGYO KK·Filed 1992·Granted Nov 8, 1994·43 cites·19 claims
- 0452US7709939B2Metal-base circuit board and its manufacturing methodDENKI KAGAKU KOGYO KK·Filed 2004·Granted May 4, 2010·7 cites·4 claims
- 0545US2011272731A1Substrate for light emitting element package, and light emitting element packageDENKI KAGAKU KOGYO KK·Filed 2008·Application pending·0 cites
- 0640US2011284914A1Method for manufacturing substrate for light emitting element package, and light emitting element packageSUZUKI MOTOHIRO·Filed 2008·Application pending·0 cites
- 0740US2011311831A1Method for manufacturing substrate for light emitting element package, and light emitting element packageSUZUKI MOTOHIRO·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →