Inventor · disambiguated record
Steven C. Avanzino
Also filed as: AVANZINO STEVEN · AVANZINO STEVEN C
127 granted patents·4 pending applications·4,338 citations·filing 1988–2014
99Inventor score
Top patents by PatentIndex Score
131 records- 0198US6528409B1Interconnect structure formed in porous dielectric material with minimized degradation and electromigrationADVANCED MICRO DEVICES INC·Filed 2002·Granted Mar 4, 2003·624 cites·67 claims
- 0297US7084062B1Use of Ta-capped metal line to improve formation of memory element filmsSPANSION LLC·Filed 2005·Granted Aug 1, 2006·46 cites·22 claims
- 0397US7035141B1Diode array architecture for addressing nanoscale resistive memory arraysSPANSION LLC·Filed 2004·Granted Apr 25, 2006·111 cites·5 claims
- 0495US5614765ASelf aligned via dual damasceneADVANCED MICRO DEVICES INC·Filed 1995·Granted Mar 25, 1997·172 cites·10 claims
- 0594US5705430ADual damascene with a sacrificial via fillADVANCED MICRO DEVICES INC·Filed 1995·Granted Jan 6, 1998·173 cites·16 claims
- 0693US7776682B1Ordered porosity to direct memory element formationSPANSION LLC·Filed 2005·Granted Aug 17, 2010·32 cites·20 claims
- 0793US6723635B1Protection low-k ILD during damascene processing with thin linerADVANCED MICRO DEVICES INC·Filed 2002·Granted Apr 20, 2004·65 cites·15 claims
- 0891US7129133B1Method and structure of memory element plug with conductive Ta removed from sidewall at region of memory element filmSPANSION LLC·Filed 2004·Granted Oct 31, 2006·60 cites·22 claims
- 0991US6657304B1Conformal barrier liner in an integrated circuit interconnectADVANCED MICRO DEVICES INC·Filed 2002·Granted Dec 2, 2003·45 cites·6 claims
- 1091US6117781AOptimized trench/via profile for damascene processingADVANCED MICRO DEVICES INC·Filed 1999·Granted Sep 12, 2000·126 cites·19 claims
- 1191US5916855AChemical-mechanical polishing slurry formulation and method for tungsten and titanium thin filmsADVANCED MICRO DEVICES INC·Filed 1997·Granted Jun 29, 1999·110 cites·53 claims
- 1291US5795823ASelf aligned via dual damasceneADVANCED MICRO DEVICES INC·Filed 1996·Granted Aug 18, 1998·114 cites·20 claims
- 1390US6562185B2Wafer based temperature sensors for characterizing chemical mechanical polishing processesADVANCED MICRO DEVICES INC·Filed 2001·Granted May 13, 2003·35 cites·31 claims
- 1490US5662769AChemical solutions for removing metal-compound contaminants from wafers after CMP and the method of wafer cleaningADVANCED MICRO DEVICES INC·Filed 1995·Granted Sep 2, 1997·107 cites·13 claims
- 1589US7307321B1Memory device with improved data retentionSPANSION LLC·Filed 2005·Granted Dec 11, 2007·21 cites·10 claims
- 1688US7465408B1Solutions for controlled, selective etching of copperADVANCED MICRO DEVICES INC·Filed 2003·Granted Dec 16, 2008·38 cites·20 claims
- 1788US7288782B1Use of Ta-capped metal line to improve formation of memory element filmsADVANCED MICRO DEVICES INC·Filed 2005·Granted Oct 30, 2007·14 cites·19 claims
- 1888US6720264B2Prevention of precipitation defects on copper interconnects during CMP by use of solutions containing organic compounds with silica adsorption and copper corrosion inhibiting propertiesADVANCED MICRO DEVICES INC·Filed 2000·Granted Apr 13, 2004·45 cites·15 claims
- 1988US6433379B1Tantalum anodization for in-laid copper metallization capacitorADVANCED MICRO DEVICES INC·Filed 2001·Granted Aug 13, 2002·43 cites·31 claims
- 2087US6989604B1Conformal barrier liner in an integrated circuit interconnectADVANCED MICRO DEVICES INC·Filed 2003·Granted Jan 24, 2006·31 cites·14 claims
- 2187US6525428B1Graded low-k middle-etch stop layer for dual-inlaid patterningADVANCE MICRO DEVICES INC·Filed 2002·Granted Feb 25, 2003·46 cites·17 claims
- 2287US6319834B1Method and apparatus for improved planarity metallization by electroplating and CMPADVANCED MICRO DEVICES INC·Filed 2000·Granted Nov 20, 2001·40 cites·18 claims
- 2386US7306988B1Memory cell and method of making the memory cellADVANCED MICRO DEVICES INC·Filed 2005·Granted Dec 11, 2007·18 cites·21 claims
- 2486US6500743B1Method of copper-polysilicon T-gate formationADVANCED MICRO DEVICES INC·Filed 2000·Granted Dec 31, 2002·36 cites·14 claims
- 2586US6235453B1Low-k photoresist removal processADVANCED MICRO DEVICES INC·Filed 1999·Granted May 22, 2001·78 cites·7 claims
- 2686US6117782AOptimized trench/via profile for damascene fillingADVANCED MICRO DEVICES INC·Filed 1999·Granted Sep 12, 2000·90 cites·20 claims
- 2785US6599827B1Methods of forming capped copper interconnects with improved electromigration resistanceADVANCED MICRO DEVICES INC·Filed 2001·Granted Jul 29, 2003·41 cites·18 claims
- 2884US6836017B2Protection of low-k ILD during damascene processing with thin linerADVANCED MICRO DEVICES INC·Filed 2004·Granted Dec 28, 2004·30 cites·9 claims
- 2984US6350687B1Method of fabricating improved copper metallization including forming and removing passivation layer before forming capping filmADVANCED MICRO DEVICES INC·Filed 1999·Granted Feb 26, 2002·75 cites·10 claims
- 3084US6143656ASlurry for chemical mechanical polishing of copperADVANCED MICRO DEVICES INC·Filed 1998·Granted Nov 7, 2000·67 cites·12 claims
- 3184US6074949AMethod of preventing copper dendrite formation and growthADVANCED MICRO DEVICES INC·Filed 1998·Granted Jun 13, 2000·72 cites·20 claims
- 3284US5691238ASubtractive dual damasceneADVANCED MICRO DEVICES INC·Filed 1995·Granted Nov 25, 1997·68 cites·19 claims
- 3384US5686354ADual damascene with a protective mask for via etchingADVANCED MICRO DEVICES INC·Filed 1995·Granted Nov 11, 1997·80 cites·11 claims
- 3484US5665199AMethodology for developing product-specific interlayer dielectric polish processesADVANCED MICRO DEVICES INC·Filed 1995·Granted Sep 9, 1997·78 cites·24 claims
- 3583US6432822B1Method of improving electromigration resistance of capped CuADVANCED MICRO DEVICES INC·Filed 2001·Granted Aug 13, 2002·33 cites·11 claims
- 3683US6184141B1Method for multiple phase polishing of a conductive layer in a semidonductor waferADVANCED MICRO DEVICES INC·Filed 1998·Granted Feb 6, 2001·64 cites·28 claims
- 3783US4954459AMethod of planarization of topologies in integrated circuit structuresADVANCED MICRO DEVICES INC·Filed 1989·Granted Sep 4, 1990·61 cites·21 claims
- 3882US6506677B1Method of forming capped copper interconnects with reduced hillock formation and improved electromigration resistanceADVANCED MICRO DEVICES INC·Filed 2001·Granted Jan 14, 2003·34 cites·18 claims
- 3982US6503418B2Ta barrier slurry containing an organic additiveADVANCED MICRO DEVICES INC·Filed 1999·Granted Jan 7, 2003·52 cites·51 claims
- 4082US6454916B1Selective electroplating with direct contact chemical polishingADVANCED MICRO DEVICES INC·Filed 2000·Granted Sep 24, 2002·13 cites·8 claims
- 4181US7071564B1Composite tantalum capped inlaid copper with reduced electromigration and reduced stress migrationADVANCED MICRO DEVICES INC·Filed 2004·Granted Jul 4, 2006·29 cites·25 claims
- 4281US5837618AUniform nonconformal deposition for forming low dielectric constant insulation between certain conductive linesADVANCED MICRO DEVICES INC·Filed 1997·Granted Nov 17, 1998·53 cites·9 claims
- 4380US7148144B1Method of forming copper sulfide layer over substrateSPANSION LLC·Filed 2004·Granted Dec 12, 2006·17 cites·28 claims
- 4480US6771356B1Scatterometry of grating structures to monitor wafer stressADVANCED MICRO DEVICES INC·Filed 2002·Granted Aug 3, 2004·24 cites·18 claims
- 4580US6211071B1Optimized trench/via profile for damascene fillingADVANCED MICRO DEVICES INC·Filed 1999·Granted Apr 3, 2001·59 cites·18 claims
- 4679US6218290B1Copper dendrite prevention by chemical removal of dielectricADVANCED MICRO DEVICES INC·Filed 1998·Granted Apr 17, 2001·56 cites·18 claims
- 4779US6121150ASputter-resistant hardmask for damascene trench/via formationADVANCED MICRO DEVICES INC·Filed 1999·Granted Sep 19, 2000·55 cites·20 claims
- 4878US6121149AOptimized trench/via profile for damascene fillingADVANCED MICRO DEVICES INC·Filed 1999·Granted Sep 19, 2000·54 cites·20 claims
- 4977US6624642B1Metal bridging monitor for etch and CMP endpoint detectionADVANCED MICRO DEVICES INC·Filed 2001·Granted Sep 23, 2003·16 cites·14 claims
- 5077US6469385B1Integrated circuit with dielectric diffusion barrier layer formed between interconnects and interlayer dielectric layersADVANCED MICRO DEVICES INC·Filed 2001·Granted Oct 22, 2002·20 cites·8 claims
Showing the top 50 of 131 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →