Inventor · disambiguated record
Toshimichi Kurihara
Also filed as: KURIHARA TOSHIMICHI
5 granted patents·1 pending application·41 citations·filing 2001–2003
76Inventor score
Top patents by PatentIndex Score
6 records- 0178US6507112B1Semiconductor device with an improved bonding pad structure and method of bonding bonding wires to bonding padsNEC COMPOUND SEMICONDUCTOR·Filed 2001·Granted Jan 14, 2003·29 cites·19 claims
- 0252US7429791B2Semiconductor device in a resin sealed package with a radiating plate and manufacturing method thereofNEC CORP·Filed 2001·Granted Sep 30, 2008·6 cites·2 claims
- 0348US7002803B2Electronic product with heat radiating plateNEC COMPOUND SEMICONDUCTOR·Filed 2003·Granted Feb 21, 2006·4 cites·42 claims
- 0448US6956167B2Lid-holding frame used in production of hollow-package type electronic products, and sealing-process using such lid-holding frameNEC COMPOUND SEMICONDUCTOR·Filed 2003·Granted Oct 18, 2005·2 cites·27 claims
- 0533US6784545B2Semiconductor device having pad electrode connected to wireNEC COMPOUND SEMICONDUCTOR·Filed 2003·Granted Aug 31, 2004·0 cites·8 claims
- 0632US2002027289A1Semiconductor device with an improved bonding pad structure and method of bonding bonding wires to bonding padsFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →