Inventor · disambiguated record
Mei-Ling Chu
Also filed as: CHU MEI LING
2 granted patents·2 pending applications·1 citations·filing 2002–2013
30Inventor score
Top patents by PatentIndex Score
4 records- 0155US2013306357A1Epoxy resin composition, and prepreg and printed circuit board usng the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2013·Application pending·0 cites
- 0251US6909931B2Method and system for estimating microelectronic fabrication product yieldTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Jun 21, 2005·1 cites·14 claims
- 0347US8734950B2Resin composition and uses of the sameCHEN HSIEN-TE·Filed 2011·Granted May 27, 2014·0 cites·12 claims
- 0443US2012024580A1Epoxy resin composition, and prepreg and printed circuit board using the sameHSU HSUAN HAO·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →