Inventor · disambiguated record
Akira Sahashi
Also filed as: SAHASHI AKIRA
4 granted patents·1 pending application·6 citations·filing 2005–2023
63Inventor score
Top patents by PatentIndex Score
5 records- 0173US7300274B2Change-over device for changing over between a heating medium and a resin material at a time of a secondary formingDENSO CORP·Filed 2005·Granted Nov 27, 2007·4 cites·13 claims
- 0263US7459118B2Heated medium supplying method and structure for secondary molding of resin molded componentDENSO CORP·Filed 2005·Granted Dec 2, 2008·1 cites·10 claims
- 0363US7438842B2Method of manufacturing resin molding and change-over device for changing over between heating medium and resin material in process of secondary formingDENSO CORP·Filed 2005·Granted Oct 21, 2008·1 cites·18 claims
- 0453US12463119B2Semiconductor device and semiconductor device manufacturing methodSEDI INC·Filed 2022·Granted Nov 4, 2025·0 cites·11 claims
- 0552US2024096723A1Semiconductor deviceSEDI INC·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →