Inventor · disambiguated record
Michael Hager
Also filed as: HAGER MICHAEL · HAGER MICHAEL B
12 granted patents·2 pending applications·210 citations·filing 1999–2019
91Inventor score
Files withHEWLETT PACKARD DEVELOPMENT CO10HEWLETT PACKARD CO2HEWLETT PACKARD DEVELOPMENT LP1TAFF BRIAN M1
Top patents by PatentIndex Score
14 records- 0195US6491377B1High print quality printheadHEWLETT PACKARD CO·Filed 1999·Granted Dec 10, 2002·93 cites·35 claims
- 0293US9156262B2Fluid ejection device with two-layer tophatTAFF BRIAN M·Filed 2012·Granted Oct 13, 2015·16 cites·6 claims
- 0387US7909428B2Fluid ejection devices and methods of fabricationHEWLETT PACKARD DEVELOPMENT CO·Filed 2006·Granted Mar 22, 2011·10 cites·20 claims
- 0483US6799822B2High quality fluid ejection deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Oct 5, 2004·19 cites·27 claims
- 0581US6746106B1Fluid ejection deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Jun 8, 2004·23 cites·25 claims
- 0678US6132033AInkjet print head with flow control manifold and columnar structuresHEWLETT PACKARD CO·Filed 1999·Granted Oct 17, 2000·37 cites·41 claims
- 0777US8991983B2Provide heat to end regions of a printhead dieHEWLETT PACKARD DEVELOPMENT CO·Filed 2013·Granted Mar 31, 2015·2 cites·13 claims
- 0870US11186089B2Ink jet prinitheadHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Nov 30, 2021·0 cites·20 claims
- 0970US10457048B2Ink jet printheadHEWLETT PACKARD DEVELOPMENT CO·Filed 2014·Granted Oct 29, 2019·1 cites·19 claims
- 1055US10493757B2Ink jet printheadHEWLETT PACKARD DEVELOPMENT CO·Filed 2014·Granted Dec 3, 2019·0 cites·20 claims
- 1155US6911155B2Methods and systems for forming slots in a substrateHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Jun 28, 2005·6 cites·17 claims
- 1250US7004556B2High print quality inkjet printheadHEWLETT PACKARD DEVELOPMENT LP·Filed 2004·Granted Feb 28, 2006·3 cites·37 claims
- 1339US2018221873A1Microfluid channel with developer portHEWLETT PACKARD DEVELOPMENT CO·Filed 2015·Application pending·0 cites
- 1430US2018290449A1Adhesion and insulating layerHEWLETT PACKARD DEVELOPMENT CO·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →