Inventor · disambiguated record
Jaekang Koh
Also filed as: KOH JAEKANG
5 granted patents·1 pending application·3 citations·filing 2020–2023
66Inventor score
Files withSAMSUNG ELECTRONICS CO LTD6
Top patents by PatentIndex Score
6 records- 0193US11791209B2Method of manufacturing a semiconductor device using a thermally decomposable layer, a semiconductor manufacturing apparatus, and the semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 17, 2023·2 cites·18 claims
- 0277US11581326B2Three-dimensional semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 14, 2023·1 cites·19 claims
- 0366US11764119B2Integrated circuit devicesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 19, 2023·0 cites·20 claims
- 0463US11482453B2Method of manufacturing a semiconductor device using a thermally decomposable layer, a semiconductor manufacturing apparatus, and the semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 25, 2022·0 cites·20 claims
- 0561US11264294B2Integrated circuit devices and manufacturing methods for the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Mar 1, 2022·0 cites·20 claims
- 0654US2024196599A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →