Inventor · disambiguated record
Mikako Okada
Also filed as: OKADA MIKAKO
8 granted patents·51 citations·filing 2008–2014
85Inventor score
Top patents by PatentIndex Score
8 records- 0188US8159058B2Semiconductor device having wiring substrate stacked on another wiring substrateISHIKAWA TOSHIKAZU·Filed 2008·Granted Apr 17, 2012·18 cites·8 claims
- 0285US8222738B2Semiconductor device, and manufacturing method thereforOTA YUSUKE·Filed 2011·Granted Jul 17, 2012·8 cites·3 claims
- 0381US8159057B2Semiconductor device and manufacturing method thereforOKADA MIKAKO·Filed 2009·Granted Apr 17, 2012·13 cites·6 claims
- 0479US8766425B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted Jul 1, 2014·3 cites·17 claims
- 0579US8383456B2Semiconductor device and manufacturing method thereforRENESAS ELECTRONICS CORP·Filed 2012·Granted Feb 26, 2013·5 cites·9 claims
- 0672US8698299B2Semiconductor device with wiring substrate including lower conductive pads and testing conductive padsISHIKAWA TOSHIKAZU·Filed 2012·Granted Apr 15, 2014·2 cites·6 claims
- 0763US8021932B2Semiconductor device, and manufacturing method thereforRENESAS ELECTRONICS CORP·Filed 2009·Granted Sep 20, 2011·2 cites·9 claims
- 0858US9330942B2Semiconductor device with wiring substrate including conductive pads and testing conductive padsRENESAS ELECTRONICS CORP·Filed 2014·Granted May 3, 2016·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →