Inventor · disambiguated record
Jie-Hung Chiou
Also filed as: CHIOU JIE-HUNG
5 granted patents·5 pending applications·8 citations·filing 2006–2009
69Inventor score
Technology areasH10W
Files withCHIPMOS TECHNOLOGIES BERMUDA6CHIOU JIE-HUNG1CHIPMOS TECHNOLOGIES SHANGHAI1CHIPMOS TECHNOLOGIES SHANGHAI LTD1QIAO YONG-CHAO1
Top patents by PatentIndex Score
10 records- 0173US7741149B2Method of fabricating chip package structureCHIPMOS TECHNOLOGIES BERMUDA·Filed 2009·Granted Jun 22, 2010·6 cites·9 claims
- 0255US8088650B2Method of fabricating chip packageQIAO YONG-CHAO·Filed 2009·Granted Jan 3, 2012·2 cites·3 claims
- 0347US7683462B2Chip package structureCHIPMOS TECHNOLOGIES BERMUDA·Filed 2007·Granted Mar 23, 2010·0 cites·2 claims
- 0445US8039946B2Chip package structure and fabricating method thereofCHIPMOS TECHNOLOGIES SHANGHAI LTD·Filed 2009·Granted Oct 18, 2011·0 cites·10 claims
- 0545US2008191324A1Chip package structure and method of fabricating the sameCHIPMOS TECHNOLOGIES BERMUDA·Filed 2007·Application pending·0 cites
- 0645US2008224277A1Chip package and method of fabricating the sameCHIPMOS TECHNOLOGIES BERMUDA·Filed 2007·Application pending·0 cites
- 0741US8105881B2Method of fabricating chip package structureCHIOU JIE-HUNG·Filed 2007·Granted Jan 31, 2012·0 cites·3 claims
- 0840US2008157304A1Chip package structureCHIPMOS TECHNOLOGIES BERMUDA·Filed 2007·Application pending·0 cites
- 0940US2008224284A1Chip package structureCHIPMOS TECHNOLOGIES BERMUDA·Filed 2007·Application pending·0 cites
- 1040US2008012106A1Chip package structure and fabricating method threrofCHIPMOS TECHNOLOGIES SHANGHAI·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →