Inventor · disambiguated record
Pei-Wei Wang
Also filed as: WANG PEI · WANG PEI-WEI
14 granted patents·4 pending applications·1 citations·filing 2001–2024
82Inventor score
Top patents by PatentIndex Score
18 records- 0169US2024282687A1Manufacturing method of circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 0266US11600936B2Circuit board structureUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Mar 7, 2023·0 cites·8 claims
- 0364US11562972B2Manufacturing method of the chip package structure having at least one chip and at least one thermally conductive elementUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Jan 24, 2023·0 cites·10 claims
- 0462US10573269B2Data transmission method and electronic deviceLENOVO BEIJING LTD·Filed 2012·Granted Feb 25, 2020·1 cites·12 claims
- 0559US12439529B2Plurality of build-up layers in a circuit board structureUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Oct 7, 2025·0 cites·11 claims
- 0659US12057381B2Circuit board having laminated build-up layersUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Aug 6, 2024·0 cites·9 claims
- 0759US11114782B2Method of manufacturing circuit board structureUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Sep 7, 2021·0 cites·4 claims
- 0857US10854803B2Manufacturing method of light emitting device package structure with circuit redistribution structureUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Dec 1, 2020·0 cites·3 claims
- 0956US11792918B2Co-axial via structureUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Oct 17, 2023·0 cites·7 claims
- 1053US11145610B2Chip package structure having at least one chip and at least one thermally conductive element and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Oct 12, 2021·0 cites·8 claims
- 1151US10651358B2Light emitting device package structure with circuit redistribution structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2018·Granted May 12, 2020·0 cites·7 claims
- 1246US11545412B2Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Jan 3, 2023·0 cites·14 claims
- 1345US10863618B2Composite substrate structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Dec 8, 2020·0 cites·15 claims
- 1444US11641720B2Circuit board and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted May 2, 2023·0 cites·16 claims
- 1543US2021096298A1Optical waveguide circuit substrate and manufacturing method thereofSUBTRON TECHNOLOGY CO LTD·Filed 2020·Application pending·0 cites
- 1639US2020118989A1Light emitting device package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2018·Application pending·0 cites
- 1733US9239593B2Information processing equipmentZHU YANLIN·Filed 2012·Granted Jan 19, 2016·0 cites·16 claims
- 1832US2002182778A1Flexible package fabrication methodFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →