Inventor · disambiguated record
Thomas J. Colosimo, Jr.
Also filed as: COLOSIMO JR THOMAS J · COLOSIMO THOMAS
24 granted patents·5 pending applications·47 citations·filing 2007–2024
93Inventor score
Top patents by PatentIndex Score
29 records- 0196US11205633B2Methods of bonding of semiconductor elements to substrates, and related bonding systemsKULICKE & SOFFA IND INC·Filed 2020·Granted Dec 21, 2021·6 cites·18 claims
- 0293US9502371B2Methods of forming wire interconnect structuresKULICKE & SOFFA IND INC·Filed 2013·Granted Nov 22, 2016·14 cites·21 claims
- 0383US9865560B2Methods of forming wire interconnect structuresKULICKE & SOFFA IND INC·Filed 2016·Granted Jan 9, 2018·3 cites·24 claims
- 0483US9478516B2Methods of operating bonding machines for bonding semiconductor elements, and bonding machinesKULICKE & SOFFA IND INC·Filed 2015·Granted Oct 25, 2016·4 cites·15 claims
- 0582US9810641B2Systems and methods for measuring physical characteristics of semiconductor device elements using structured lightKULICKE & SOFFA IND INC·Filed 2014·Granted Nov 7, 2017·7 cites·13 claims
- 0682US9426898B2Thermocompression bonders, methods of operating thermocompression bonders, and interconnect methods for fine pitch flip chip assemblyKULICKE & SOFFA IND INC·Filed 2015·Granted Aug 23, 2016·4 cites·19 claims
- 0780US10468373B2Bonding machines for bonding semiconductor elements, methods of operating bonding machines, and techniques for improving UPH on such bonding machinesKULICKE & SOFFA IND INC·Filed 2018·Granted Nov 5, 2019·4 cites·14 claims
- 0879US11615972B2Reusable die catch materials, reusable die release materials, related die transfer systems, and methods of using the sameKULICKE & SOFFA NETHERLANDS B V·Filed 2021·Granted Mar 28, 2023·1 cites·19 claims
- 0978US12381175B2Bonding systems, and methods of providing a reducing gas on a bonding systemKULICKE & SOFFA IND INC·Filed 2024·Granted Aug 5, 2025·0 cites·20 claims
- 1072US12062636B2Bonding systems, and methods of providing a reducing gas on a bonding systemKULICKE & SOFFA IND INC·Filed 2023·Granted Aug 13, 2024·0 cites·22 claims
- 1172US2024266318A1Bonding systems for bonding a semiconductor element to a substrate, and related methodsKULICKE & SOFFA IND INC·Filed 2024·Application pending·0 cites
- 1270US10153247B2Methods of forming wire interconnect structuresKULICKE & SOFFA IND INC·Filed 2017·Granted Dec 11, 2018·1 cites·24 claims
- 1370US9165902B2Methods of operating bonding machines for bonding semiconductor elements, and bonding machinesKULICKE & SOFFA IND INC·Filed 2014·Granted Oct 20, 2015·2 cites·11 claims
- 1468US2024063169A1Bonding systems for bonding a semiconductor element to a substrate, and related methodsKULICKE & SOFFA IND INC·Filed 2023·Application pending·0 cites
- 1565US9929121B2Bonding machines for bonding semiconductor elements, methods of operating bonding machines, and techniques for improving UPH on such bonding machinesKULICKE & SOFFA IND INC·Filed 2016·Granted Mar 27, 2018·1 cites·34 claims
- 1664US11616042B2Methods of bonding of semiconductor elements to substrates, and related bonding systemsKULICKE & SOFFA IND INC·Filed 2021·Granted Mar 28, 2023·0 cites·20 claims
- 1762US12500204B2Bonding systems for bonding of semiconductor elements to substrates including a gas composition analyzer, and related methodsKULICKE & SOFFA IND INC·Filed 2022·Granted Dec 16, 2025·0 cites·21 claims
- 1862US12431459B2Methods of monitoring gas byproducts of a bonding system, and related monitoring systems and bonding systemsKULICKE & SOFFA IND INC·Filed 2023·Granted Sep 30, 2025·0 cites·26 claims
- 1962US2025096193A1Methods of bonding semiconductor elements to substratesKULICKE & SOFFA IND INC·Filed 2024·Application pending·0 cites
- 2061US11342301B2Bonding tools for bonding machines, bonding machines for bonding semiconductor elements, and related methodsKULICKE & SOFFA IND INC·Filed 2021·Granted May 24, 2022·0 cites·20 claims
- 2160US2023197478A1Reusable die catch materials, reusable die release materials, related die transfer systems, and methods of using the sameKULICKE & SOFFA NETHERLANDS B V·Filed 2023·Application pending·0 cites
- 2259US2024332244A1Methods of processing a substrate on a bonding system, and related bonding systemsKULICKE & SOFFA IND INC·Filed 2024·Application pending·0 cites
- 2356US9847313B2Thermocompression bonders, methods of operating thermocompression bonders, and horizontal scrub motions in thermocompression bondingKULICKE & SOFFA IND INC·Filed 2016·Granted Dec 19, 2017·0 cites·23 claims
- 2453US11515286B2Methods of bonding of semiconductor elements to substrates, and related bonding systemsKULICKE & SOFFA IND INC·Filed 2021·Granted Nov 29, 2022·0 cites·28 claims
- 2551US11049839B2Bonding tools for bonding machines, bonding machines for bonding semiconductor elements, and related methodsKULICKE & SOFFA IND INC·Filed 2019·Granted Jun 29, 2021·0 cites·17 claims
- 2651US10352877B2Systems and methods for measuring physical characteristics of semiconductor device elements using structured lightKULICKE & SOFFA IND INC·Filed 2017·Granted Jul 16, 2019·0 cites·17 claims
- 2743US9016107B2Method of calibrating a constant voltage supply for an ultrasonic transducer of a wire bonding machineQIN IVY WEI·Filed 2007·Granted Apr 28, 2015·0 cites·20 claims
- 2842US10245668B2Fluxing systems, bonding machines including fluxing systems, and methods of operating the sameKULICKE & SOFFA IND INC·Filed 2017·Granted Apr 2, 2019·0 cites·19 claims
- 2941US9731378B2Thermocompression bonders, methods of operating thermocompression bonders, and horizontal correction motions using lateral force measurement in thermocompression bondingKULICKE & SOFFA IND INC·Filed 2016·Granted Aug 15, 2017·0 cites·23 claims
Join the waitlist — get patent alerts
Get an alert when Thomas J. Colosimo, Jr. files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →