Inventor · disambiguated record
Alain Gueugnot
Also filed as: GUEUGNOT ALAIN
2 granted patents·4 citations·filing 2008–2014
45Inventor score
Technology areasH10W
Files withCOMMISSARIAT ENERGIE ATOMIQUE2
Top patents by PatentIndex Score
2 records- 0163US9406662B2Flip-chip assembly process comprising pre-coating interconnect elementsCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2014·Granted Aug 2, 2016·3 cites·8 claims
- 0254US7645686B2Method of bonding chips on a strained substrate and method of placing under strain a semiconductor reading circuitCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2008·Granted Jan 12, 2010·1 cites·6 claims
Join the waitlist — get patent alerts
Get an alert when Alain Gueugnot files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →