Inventor · disambiguated record
Alexis Bedoin
Also filed as: BEDOIN ALEXIS
2 granted patents·1 pending application·4 citations·filing 2013–2015
45Inventor score
Technology areasH10W
Files withCOMMISSARIAT ENERGIE ATOMIQUE3
Top patents by PatentIndex Score
3 records- 0163US9406662B2Flip-chip assembly process comprising pre-coating interconnect elementsCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2014·Granted Aug 2, 2016·3 cites·8 claims
- 0248US9368472B2Flip-chip assembly process for connecting two components to each otherCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2013·Granted Jun 14, 2016·1 cites·20 claims
- 0326US2015259197A1Process for hybridizing by adhesive bonding two microelectronic elementsCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →