Inventor · disambiguated record
Dennis Tak Kit Tong
Also filed as: TONG DENNIS · TONG DENNIS TAK KIT
11 granted patents·1 pending application·53 citations·filing 2001–2016
88Inventor score
Top patents by PatentIndex Score
12 records- 0187US9671576B1CWDM transceiver moduleSAE MAGNETICS HK LTD·Filed 2016·Granted Jun 6, 2017·6 cites·17 claims
- 0285US8708575B2Active optical connector using audio portSAE MAGNETICS HK LTD·Filed 2012·Granted Apr 29, 2014·10 cites·20 claims
- 0384US9052476B2Wafer-level packaged optical subassembly and transceiver module having sameSAE MAGNETICS HK LTD·Filed 2013·Granted Jun 9, 2015·5 cites·15 claims
- 0484US7940500B2Multi-chip module package including external and internal electrostatic discharge protection circuits, and/or method of making the sameSAE MAGNETICS HK LTD·Filed 2008·Granted May 10, 2011·12 cites·20 claims
- 0579US8807846B2Pluggable optical transceiverSAE MAGNETICS HK LTD·Filed 2013·Granted Aug 19, 2014·6 cites·20 claims
- 0667US9739958B2Wafer level packaged optical subassembly and transceiver module having sameSAE MAGNETICS HK LTD·Filed 2016·Granted Aug 22, 2017·1 cites·20 claims
- 0767US9679784B2Wafer-level packaged optical subassembly and transceiver module having sameSAE MAGNETICS HK LTD·Filed 2015·Granted Jun 13, 2017·1 cites·17 claims
- 0866US8998649B2Serial electrical connectorSAE MAGNETICS HK LTD·Filed 2013·Granted Apr 7, 2015·5 cites·20 claims
- 0960US7058312B2Opto-electronic phase-locked loop with microwave mixing for clock recoveryAGERE SYSTEMS INC·Filed 2001·Granted Jun 6, 2006·7 cites·24 claims
- 1057US9429727B2Wafer level packaged optical subassembly and transceiver module having sameSAE MAGNETICS HK LTD·Filed 2014·Granted Aug 30, 2016·0 cites·19 claims
- 1149US9142693B2Optoelectronic package and method for making sameSAE MAGNETICS HK LTD·Filed 2013·Granted Sep 22, 2015·0 cites·2 claims
- 1244US2015348953A1Optoelectronic package and method for making sameSAE MAGNETICS HK LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →