Inventor · disambiguated record
Shinji Ota
Also filed as: OTA SHINJI
22 granted patents·6 pending applications·292 citations·filing 1992–2018
95Inventor score
Top patents by PatentIndex Score
28 records- 0189US7622219B2Battery packPANASONIC CORP·Filed 2005·Granted Nov 24, 2009·14 cites·15 claims
- 0289US6376906B1Mounting structure of semiconductor elementDENSO CORP·Filed 1998·Granted Apr 23, 2002·122 cites·42 claims
- 0383US11374290B2Power supply device, vehicle in which same is used, and bus barSANYO ELECTRIC CO·Filed 2017·Granted Jun 28, 2022·2 cites·11 claims
- 0482US11289773B2Power supply device, vehicle using same, bus bar, and electrical connection method for battery cell using same bus barSANYO ELECTRIC CO·Filed 2017·Granted Mar 29, 2022·2 cites·15 claims
- 0582US10509714B2Information processing apparatus and information processing systemMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Dec 17, 2019·4 cites·16 claims
- 0678US6992981B2Communication system and method capable of avoiding congestion in moving image data transmissionKDDI R & D LAB INC·Filed 2002·Granted Jan 31, 2006·32 cites·20 claims
- 0775US8032769B2Controlling apparatus, controlling method, computer readable medium, image forming apparatus and information processing apparatusFUJI XEROX CO LTD·Filed 2008·Granted Oct 4, 2011·8 cites·19 claims
- 0872US6007263ADevice for parallel justification of print head relative to the platenCASIO COMPUTER CO LTD·Filed 1997·Granted Dec 28, 1999·32 cites·6 claims
- 0970US9101023B2Light-emitting element driving circuit and display deviceNLT TECHNOLOGIES LTD·Filed 2013·Granted Aug 4, 2015·2 cites·9 claims
- 1062US6203902B1Drawing method and drawn materialUBE NITTO KASEI CO·Filed 1999·Granted Mar 20, 2001·14 cites·8 claims
- 1162US5321382AThermal type flow rate sensorNIPPON DENSO CO·Filed 1992·Granted Jun 14, 1994·21 cites·10 claims
- 1259US8797250B2Liquid crystal display device, and timing controller and signal processing method used in sameOTA SHINJI·Filed 2010·Granted Aug 5, 2014·1 cites·13 claims
- 1359US8107117B2Information processing device, information collection device, information collection system, and method for management of information related functionsHARADA MASAHIKO·Filed 2007·Granted Jan 31, 2012·2 cites·13 claims
- 1455US7429973B2Content display system and methodKDDI R & D LAB INC·Filed 2002·Granted Sep 30, 2008·5 cites·26 claims
- 1550US11515607B2Method of interrupting inflow current in battery systemSANYO ELECTRIC CO·Filed 2018·Granted Nov 29, 2022·0 cites·5 claims
- 1650US11450923B2Method for interrupting short circuit current in battery system, battery system, and electric vehicle and power storage device which are equipped with battery systemSANYO ELECTRIC CO·Filed 2018·Granted Sep 20, 2022·0 cites·7 claims
- 1750US6544462B1Drawing methodUBE NITTO KASEI CO·Filed 2000·Granted Apr 8, 2003·1 cites·12 claims
- 1850US6217990B1Multilayer circuit board having no local warp on mounting surface thereofDENSO CORP·Filed 1998·Granted Apr 17, 2001·19 cites·13 claims
- 1946US2012129043A1Method for producing assembled battery and assembled batteryFUKUDA SHINSUKE·Filed 2011·Application pending·0 cites
- 2045US2008250472A1Information processing system, information processing apparatus, information processing method and computer readable mediumFUJI XEROX CO LTD·Filed 2008·Application pending·0 cites
- 2139US5932941ASpindle motor and method of manufacturing the sameSANKYO SEIKI SEISAKUSHO KK·Filed 1997·Granted Aug 3, 1999·9 cites·6 claims
- 2239US2012121969A1Battery pack case and method for manufacturing the same, and battery pack and method for manufacturing the sameTAKEMURA TAKASHI·Filed 2010·Application pending·0 cites
- 2338US2012129017A1Battery pack and manufacturing method thereofOTA SHINJI·Filed 2011·Application pending·0 cites
- 2437US2013095370A1Battery assembly production method and battery assemblyOTA SHINJI·Filed 2011·Application pending·0 cites
- 2536US2012135300A1Battery storage case and battery pack having the sameOTA SHINJI·Filed 2011·Application pending·0 cites
- 2631US8531013B2Semiconductor device equipped with bonding wires and manufacturing method of semiconductor device equipped with bonding wiresSHINDO TEIJI·Filed 2011·Granted Sep 10, 2013·0 cites·46 claims
- 2731US5754093AThick-film printed substrate including an electrically connecting member and method for fabricating the sameNIPPON DENSO CO·Filed 1996·Granted May 19, 1998·1 cites·20 claims
- 2828US6406283B1Device for drawing drawable thermoplastic resin materialUBE NITTO KASEI CO·Filed 1999·Granted Jun 18, 2002·1 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →