Inventor · disambiguated record
Thomas Kaden
Also filed as: KADEN THOMAS
7 granted patents·3 pending applications·14 citations·filing 2003–2022
75Inventor score
Top patents by PatentIndex Score
10 records- 0172US11480495B2Position-tolerance-insensitive contacting module for contacting optoelectronic chipsJENOPTIK OPTICAL SYS GMBH·Filed 2018·Granted Oct 25, 2022·2 cites·12 claims
- 0271US7582832B2Bond and method for bonding two contact surfacesBOSCH GMBH ROBERT·Filed 2007·Granted Sep 1, 2009·8 cites·10 claims
- 0347US12203983B2Contacting module for contacting optoelectronic chipsJENOPTIK OPTICAL SYS GMBH·Filed 2021·Granted Jan 21, 2025·0 cites·7 claims
- 0446US7581667B2Tool head for attaching an electrical conductor on the contact surface of a substrate and method for implementing the attachmentBOSCH GMBH ROBERT·Filed 2003·Granted Sep 1, 2009·4 cites·7 claims
- 0546US2024361542A1Optical device and method for producing an optical deviceJENOPTIK OPTICAL SYS GMBH·Filed 2022·Application pending·0 cites
- 0644US12210057B2Wafer-level test method for optoelectronic chipsJENOPTIK OPTICAL SYS GMBH·Filed 2022·Granted Jan 28, 2025·0 cites·11 claims
- 0737US11906579B2Wafer-level test method for optoelectronic chipsJENOPTIK OPTICAL SYS GMBH·Filed 2020·Granted Feb 20, 2024·0 cites·6 claims
- 0829US2007290373A1Multilayer bonding ribbonREINOLD MANFRED·Filed 2007·Application pending·0 cites
- 0929US2008061450A1Bonding wire and bond using a bonding wireREINOLD MANFRED·Filed 2007·Application pending·0 cites
- 1027US8933546B2Electronic assembly with improved thermal managementLEHTONEN PAEIVI·Filed 2011·Granted Jan 13, 2015·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →