Inventor · disambiguated record
Cheng-Tar Wu
Also filed as: WU CHENG-TAR
5 granted patents·1 pending application·84 citations·filing 2009–2022
77Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD3FAR EASTERN NEW CENTURY CORP2CHENGDU ESWIN SYSTEM IC CO LTD1
Top patents by PatentIndex Score
6 records- 0198US10157849B2Packages with molding structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·54 cites·20 claims
- 0296US9601353B2Packages with molding structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Mar 21, 2017·28 cites·19 claims
- 0374US9892962B2Wafer level chip scale package interconnects and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 13, 2018·2 cites·20 claims
- 0452US12438086B2Semiconductor package and method of forming the same with dielectric layer disposed between protective mold structure and stepped structure of side portion of semiconductor dieCHENGDU ESWIN SYSTEM IC CO LTD·Filed 2022·Granted Oct 7, 2025·0 cites·8 claims
- 0552US8034892B2Biocidal polymer and process for preparing the sameFAR EASTERN NEW CENTURY CORP·Filed 2009·Granted Oct 11, 2011·0 cites·30 claims
- 0639US2011129437A1Platelet adhesion-resistant materialFAR EASTERN NEW CENTURY CORP·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →