Inventor · disambiguated record
Syunsuke Hirano
Also filed as: HIRANO SYUNSUKE
7 granted patents·3 pending applications·0 citations·filing 2013–2021
67Inventor score
Files withMITSUBISHI GAS CHEMICAL CO10
Top patents by PatentIndex Score
10 records- 0157US2021257207A1Supporting substrate, supporting substrate-attached laminate and method for manufacturing a package substrate for mounting a semiconductor deviceMITSUBISHI GAS CHEMICAL CO·Filed 2021·Application pending·0 cites
- 0250US2015056454A1Resin composition, prepreg, and metal foil-clad laminateMITSUBISHI GAS CHEMICAL CO·Filed 2013·Application pending·0 cites
- 0350US2015210832A1Resin sheet, support with resin layer, laminate and metal foil-clad laminateMITSUBISHI GAS CHEMICAL CO·Filed 2013·Application pending·0 cites
- 0449US11217445B2Supporting substrate, supporting substrate-attached laminate and method for manufacturing a package substrate for mounting a semiconductor deviceMITSUBISHI GAS CHEMICAL CO·Filed 2017·Granted Jan 4, 2022·0 cites·9 claims
- 0546US11664240B2Method for producing laminate having patterned metal foil, and laminate having patterned metal foilMITSUBISHI GAS CHEMICAL CO·Filed 2018·Granted May 30, 2023·0 cites·11 claims
- 0646US11197379B2Method for producing printed wiring boardMITSUBISHI GAS CHEMICAL CO·Filed 2018·Granted Dec 7, 2021·0 cites·9 claims
- 0745US12119277B2Method for producing package substrate for mounting semiconductor deviceMITSUBISHI GAS CHEMICAL CO·Filed 2019·Granted Oct 15, 2024·0 cites·7 claims
- 0843US11877396B2Laminate, metal foil-clad laminate, laminate having patterned metal foil, laminate having buildup structure, printed wiring board, multilayer coreless substrate, and method for producing sameMITSUBISHI GAS CHEMICAL CO·Filed 2019·Granted Jan 16, 2024·0 cites·13 claims
- 0942US11990349B2Method for producing package substrate for loading semiconductor deviceMITSUBISHI GAS CHEMICAL CO·Filed 2019·Granted May 21, 2024·0 cites·6 claims
- 1037US10727081B2Method for manufacturing package substrate for mounting a semiconductor device, and method for manufacturing semiconductor device mounting substrateMITSUBISHI GAS CHEMICAL CO·Filed 2017·Granted Jul 28, 2020·0 cites·13 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →