Inventor · disambiguated record
Chun Yuan Tsai
Also filed as: TSAI CHUN YUAN
3 granted patents·13 citations·filing 2014–2016
66Inventor score
Technology areasH10W
Files withADVANCED SEMICONDUCTOR ENG3
Top patents by PatentIndex Score
3 records- 0183US9922917B2Semiconductor package including substrates spaced by at least one electrical connecting elementADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Mar 20, 2018·5 cites·25 claims
- 0276US9443785B2Semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Sep 13, 2016·4 cites·20 claims
- 0367US10032652B2Semiconductor package having improved package-on-package interconnectionADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Jul 24, 2018·4 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →