Inventor · disambiguated record
Aya Ikeda
Also filed as: IKEDA AYA
4 granted patents·3 pending applications·6 citations·filing 2012–2023
65Inventor score
Top patents by PatentIndex Score
7 records- 0175US10808150B2Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging elementHITACHI CHEMICAL CO LTD·Filed 2018·Granted Oct 20, 2020·3 cites·14 claims
- 0269US2024209177A1Method of desulfurizing sulfur-crosslinked rubberTOYODA GOSEI KK·Filed 2023·Application pending·0 cites
- 0365US9868884B2Adhesive composition, method for manufacturing semiconductor device using adhesive composition, and solid-state imaging elementHITACHI CHEMICAL CO LTD·Filed 2015·Granted Jan 16, 2018·2 cites·15 claims
- 0456US10358580B2Adhesive composition, resin cured product obtained from adhesive composition, method for manufacturing semiconductor device using adhesive composition, and solid-state imaging elementHITACHI CHEMICAL CO LTD·Filed 2015·Granted Jul 23, 2019·1 cites·13 claims
- 0545US9920227B2Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging elementHITACHI CHEMICAL CO LTD·Filed 2015·Granted Mar 20, 2018·0 cites·18 claims
- 0635US2012202015A1Method for manufacturing adhesion body, method for manufacturing substrate with adhesive pattern, and substrate with adhesive patternIKEDA AYA·Filed 2012·Application pending·0 cites
- 0735US2019241694A1Curable composition for forming elastic resin layerHITACHI CHEMICAL CO LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →