Inventor · disambiguated record
Vadim Gektin
Also filed as: GEKTIN VADIM
25 granted patents·4 pending applications·247 citations·filing 2000–2024
95Inventor score
Files withSUN MICROSYSTEMS INC11FUTUREWEI TECHNOLOGIES INC8ORACLE AMERICA INC3GEKTIN VADIM2ANKIREDDI SESHASAYEE1
Top patents by PatentIndex Score
29 records- 0189US10117357B2Stationary cooling structure for board/chassis-level conduction coolingFUTUREWEI TECHNOLOGIES INC·Filed 2015·Granted Oct 30, 2018·11 cites·11 claims
- 0288US7301227B1Package lid or heat spreader for microprocessor packagesSUN MICROSYSTEMS INC·Filed 2005·Granted Nov 27, 2007·18 cites·20 claims
- 0385US7007741B2Conformal heat spreaderSUN MICROSYSTEMS INC·Filed 2002·Granted Mar 7, 2006·43 cites·4 claims
- 0485US6945315B1Heatsink with active liquid baseSUN MICROSYSTEMS INC·Filed 2000·Granted Sep 20, 2005·42 cites·9 claims
- 0584US9196564B2Apparatus and method for a back plate for heat sink mountingFUTUREWEI TECHNOLOGIES INC·Filed 2013·Granted Nov 24, 2015·8 cites·12 claims
- 0684US7187550B1Gasketed field-replaceable active integrated liquid pump heat sink module for thermal management of electronic componentsSUN MICROSYSTEMS INC·Filed 2005·Granted Mar 6, 2007·12 cites·20 claims
- 0783US8331094B2Thermal and power bus stacked package architectureANKIREDDI SESHASAYEE·Filed 2011·Granted Dec 11, 2012·12 cites·20 claims
- 0882US7619308B1Multi-lid semiconductor packageSUN MICROSYSTEMS INC·Filed 2008·Granted Nov 17, 2009·11 cites·20 claims
- 0981US8884425B1Thermal management in 2.5 D semiconductor packagingFUTUREWEI TECHNOLOGIES INC·Filed 2013·Granted Nov 11, 2014·5 cites·21 claims
- 1079US9813082B2Heat spreader with thermally coductive foam coreFUTUREWEI TECHNOLOGIES INC·Filed 2015·Granted Nov 7, 2017·4 cites·15 claims
- 1179US7939364B2Optimized lid attach process for thermal management and multi-surface compliant heat removalORACLE AMERICA INC·Filed 2008·Granted May 10, 2011·7 cites·7 claims
- 1279US6836408B2Method and apparatus for force transfer via bare die packageSUN MICROSYSTEMS INC·Filed 2002·Granted Dec 28, 2004·30 cites·31 claims
- 1376US8767391B2Chassis with adjustable baffle for coolingJIN YOULIN·Filed 2012·Granted Jul 1, 2014·6 cites·23 claims
- 1474US7791194B2Composite interconnectORACLE AMERICA INC·Filed 2008·Granted Sep 7, 2010·6 cites·20 claims
- 1569US6637506B2Multi-material heat spreaderSUN MICROSYSTEMS INC·Filed 2002·Granted Oct 28, 2003·16 cites·28 claims
- 1660US6649443B2System for facilitating alignment of silicon dieSUN MICROSYSTEMS INC·Filed 2001·Granted Nov 18, 2003·9 cites·18 claims
- 1753US6653167B2Facilitating heat transfer from an integrated circuit packageSUN MICROSYSTEMS INC·Filed 2001·Granted Nov 25, 2003·5 cites·11 claims
- 1852US2025224787A1Performing thermal management based on temperature evolution models in processor devicesQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1949US9241421B2Centralized chassis architecture for half-width boardsFUTUREWEI TECHNOLOGIES INC·Filed 2013·Granted Jan 19, 2016·0 cites·20 claims
- 2048US9851520B2Optical communication component coolingFUTUREWEI TECHNOLOGIES INC·Filed 2016·Granted Dec 26, 2017·0 cites·20 claims
- 2147US10418829B2Charger having retractable cooling surfaceFUTUREWEI TECHNOLOGIES INC·Filed 2017·Granted Sep 17, 2019·0 cites·14 claims
- 2247US8097813B2Carbon nanotube based interposerGEKTIN VADIM·Filed 2009·Granted Jan 17, 2012·0 cites·16 claims
- 2346US6727193B2Apparatus and methods for enhancing thermal performance of integrated circuit packagesSUN MICROSYSTEMS INC·Filed 2002·Granted Apr 27, 2004·2 cites·16 claims
- 2443US8283204B2Optimized lid attach process for thermal management and multi-surface compliant heat removalGEKTIN VADIM·Filed 2011·Granted Oct 9, 2012·0 cites·6 claims
- 2541US10292308B2Fluid coupling mating apparatus and methodFUTUREWEI TECHNOLOGIES INC·Filed 2015·Granted May 14, 2019·0 cites·20 claims
- 2638US8368205B2Metallic thermal joint for high power density chipsORACLE AMERICA INC·Filed 2010·Granted Feb 5, 2013·0 cites·18 claims
- 2736US2004065410A1Method and apparatus for dispensing interface materialsSUN MICROSYSTEMS INC·Filed 2002·Application pending·0 cites
- 2835US2002177306A1Method to place a thermal interface when manufacturing an integrated circuitFiled 2001·Application pending·0 cites
- 2934US2004042178A1Heat spreader with surface cavityFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →