Inventor · disambiguated record
Keishi Ono
Also filed as: ONO KEISHI
6 granted patents·12 pending applications·4 citations·filing 2011–2024
70Inventor score
Files withRESONAC CORP8SHOWA DENKO MATERIALS CO LTD4HITACHI CHEMICAL CO LTD3HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD2KOTANI MASASHI1
Top patents by PatentIndex Score
18 records- 0169US11608455B2Adhesive for semiconductor device, and high productivity method for manufacturing said deviceHITACHI CHEMICAL CO LTD·Filed 2019·Granted Mar 21, 2023·1 cites·14 claims
- 0267US10725379B2Polymide precursor resin compositionHITACHI CHEMICAL DUPONT MICROSYSTEMS LTD·Filed 2013·Granted Jul 28, 2020·1 cites·10 claims
- 0366US10669454B2Method for manufacturing semiconductor device including heating and pressuring a laminate having an adhesive layerHITACHI CHEMICAL CO LTD·Filed 2016·Granted Jun 2, 2020·1 cites·11 claims
- 0458US2024402603A1Photosensitive resin composition, photosensitive element, and method for producing layered bodyRESONAC CORP·Filed 2022·Application pending·0 cites
- 0557US9751984B2Polyimide precursor, photosensitive resin composition containing said polyimide precursor, and cured-pattern-film manufacturing method and semiconductor device using said photosensitive resin compositionHITACHI CHEMICAL DUPONT MICROSYSTEMS LTD·Filed 2013·Granted Sep 5, 2017·1 cites·13 claims
- 0657US2025004369A1Photosensitive resin composition, photosensitive element, and laminate production methodRESONAC CORP·Filed 2022·Application pending·0 cites
- 0756US2025390018A1Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing circuit boardRESONAC CORP·Filed 2024·Application pending·0 cites
- 0853US2025267799A1Method for manufacturing wiring board, method for evaluating resist layer or wiring board, and wiring boardRESONAC CORP·Filed 2023·Application pending·0 cites
- 0952US2023145264A1Photosensitive resin composition, photosensitive element, and method for producing wiring boardSHOWA DENKO MATERIALS CO LTD·Filed 2021·Application pending·0 cites
- 1051US2025390020A1Photosensitive resin composition, photosensitive element, cured product, method for forming resist pattern, and method for manufacturing printed wiring boardRESONAC CORP·Filed 2024·Application pending·0 cites
- 1151US2023161248A1Photosensitive film, photosensitive element, and method for producing laminateSHOWA DENKO MATERIALS CO LTD·Filed 2022·Application pending·0 cites
- 1250US2024341039A1Method for manufacturing wiring board, and wiring boardRESONAC CORP·Filed 2022·Application pending·0 cites
- 1347US2024015889A1Method for producing wiring board, and wiring boardRESONAC CORP·Filed 2021·Application pending·0 cites
- 1442US2025344324A1Pattern formation method and pattern formation structureRESONAC CORP·Filed 2022·Application pending·0 cites
- 1541US10224311B2Semiconductor adhesive, and semiconductor device and method for manufacturing sameHITACHI CHEMICAL CO LTD·Filed 2015·Granted Mar 5, 2019·0 cites·20 claims
- 1638US2022267484A1Photosensitive resin composition, photosensitive resin film, method for producing cured product, laminate, and electronic componentSHOWA DENKO MATERIALS CO LTD·Filed 2019·Application pending·0 cites
- 1736US2024111211A1Photosensitive resin film, resist pattern forming method, and wiring pattern forming methodSHOWA DENKO MATERIALS CO LTD·Filed 2019·Application pending·0 cites
- 1826US9134608B2Positive photosensitive resin composition, method for producing patterned cured film and electronic componentKOTANI MASASHI·Filed 2011·Granted Sep 15, 2015·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →