Inventor · disambiguated record
Mika Tsuda
Also filed as: TSUDA Mika
3 granted patents·7 pending applications·2 citations·filing 2014–2016
51Inventor score
Files withSUMITOMO BAKELITE CO10
Top patents by PatentIndex Score
10 records- 0158US10720375B2Substrate for power module, circuit board for power module, and power moduleSUMITOMO BAKELITE CO·Filed 2016·Granted Jul 21, 2020·1 cites·16 claims
- 0253US10269689B2Thermally conductive sheet and semiconductor deviceSUMITOMO BAKELITE CO·Filed 2015·Granted Apr 23, 2019·1 cites·6 claims
- 0335US2016002439A1Apparatus, composition for adhesive, and adhesive sheetSUMITOMO BAKELITE CO·Filed 2014·Application pending·0 cites
- 0432US2016002520A1Thermally conductive sheet, cured product thereof, and semiconductor deviceSUMITOMO BAKELITE CO·Filed 2015·Application pending·0 cites
- 0531US9859189B2Thermally conductive sheet and semiconductor deviceSUMITOMO BAKELITE CO·Filed 2015·Granted Jan 2, 2018·0 cites·9 claims
- 0628US2015342052A1Circuit substrate, electronic component mounting substrate and method for producing circuit substrateSUMITOMO BAKELITE CO·Filed 2015·Application pending·0 cites
- 0728US2016122503A1Resin composition for thermally conductive sheet, base material-attached resin layer, thermally conductive sheet, and semiconductor deviceSUMITOMO BAKELITE CO·Filed 2015·Application pending·0 cites
- 0827US2016002445A1Thermally conductive sheet, cured product thereof, and semiconductor deviceSUMITOMO BAKELITE CO·Filed 2015·Application pending·0 cites
- 0927US2016005677A1Thermally conductive sheet, cured product thereof, and semiconductor deviceSUMITOMO BAKELITE CO·Filed 2015·Application pending·0 cites
- 1025US2018208820A1Thermal conductive resin composition, thermal conductive sheet, and semiconductor deviceSUMITOMO BAKELITE CO·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →