Inventor · disambiguated record
Jared Pettit
Also filed as: PETTIT JARED · PETTIT JARED MICHAEL
9 granted patents·1 pending application·12 citations·filing 2014–2019
81Inventor score
Technology areasH10P
Top patents by PatentIndex Score
10 records- 0184US9455283B2Etch chemistries for metallization in electronic devicesHOGAN PATRICK·Filed 2015·Granted Sep 27, 2016·4 cites·27 claims
- 0279US9790407B2Aqueous detergent soluble coating and adhesive and methods of temporary bonding for manufacturingMOORE JOHN·Filed 2014·Granted Oct 17, 2017·4 cites·22 claims
- 0377US10186530B2Etch chemistries for metallization in electronic devicesHOGAN PATRICK·Filed 2016·Granted Jan 22, 2019·2 cites·36 claims
- 0473US10923514B2Etch chemistries for metallization in electronic devicesHOGAN PATRICK·Filed 2018·Granted Feb 16, 2021·1 cites·14 claims
- 0560US10147630B2Sectional porous carrier forming a temporary impervious supportMOORE JOHN CLEAON·Filed 2015·Granted Dec 4, 2018·1 cites·8 claims
- 0653US10696874B2Adhesive with tunable porosity and methods to support temporary bonding applicationsMOORE JOHN CLEAON·Filed 2019·Granted Jun 30, 2020·0 cites·8 claims
- 0751US11004718B2Sectional porous carrier forming a temporary impervious supportMOORE JOHN CLEAON·Filed 2018·Granted May 11, 2021·0 cites·8 claims
- 0851US2016017184A1Adhesive with tunable porosity and methods to support temporary bonding applicationsMOORE JOHN·Filed 2014·Application pending·0 cites
- 0948US10000675B2Temporary adhesive with tunable adhesion force sufficient for processing thin solid materialsMOORE JOHN CLEAON·Filed 2014·Granted Jun 19, 2018·0 cites·21 claims
- 1045US10290531B2Release layer for subsequent manufacture of flexible substrates in microelectronic applicationsMOORE JOHN CLEAON·Filed 2014·Granted May 14, 2019·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →