Inventor · disambiguated record
Norzafriza Nitta
Also filed as: NITTA NORZAFRIZA
2 granted patents·6 pending applications·0 citations·filing 2019–2024
23Inventor score
Files withFURUKAWA ELECTRIC CO LTD8
Top patents by PatentIndex Score
8 records- 0173US2019264072A1Joining film, tape for wafer processing, method for producing joined body, and joined bodyFURUKAWA ELECTRIC CO LTD·Filed 2019·Application pending·0 cites
- 0264US2021348038A1Joining film, tape for wafer processing, method for producing joined body, and joined bodyFURUKAWA ELECTRIC CO LTD·Filed 2021·Application pending·0 cites
- 0363US2021189198A1Joining film, tape for wafer processing, method for producing joined body, and joined bodyFURUKAWA ELECTRIC CO LTD·Filed 2021·Application pending·0 cites
- 0463US2021189197A1Joining film, tape for wafer processing, method for producing joined body, and joined bodyFURUKAWA ELECTRIC CO LTD·Filed 2021·Application pending·0 cites
- 0563US2024408703A1Bonding material composition, method for manufacturing bonding material composition, bonding film, method for manufacturing bonded body, and bonded bodyFURUKAWA ELECTRIC CO LTD·Filed 2024·Application pending·0 cites
- 0661US11466181B2Metal particle-containing composition and electrically conductive adhesive filmFURUKAWA ELECTRIC CO LTD·Filed 2021·Granted Oct 11, 2022·0 cites·15 claims
- 0755US12374646B2Bonding film, tape for wafer processing, method for producing bonded body, and bonded body and pasted bodyFURUKAWA ELECTRIC CO LTD·Filed 2022·Granted Jul 29, 2025·0 cites·20 claims
- 0834US2019273062A1Joining film and tape for wafer processingFURUKAWA ELECTRIC CO LTD·Filed 2019·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Norzafriza Nitta files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →