Inventor · disambiguated record
Nozad Karim
Also filed as: KARIM NOZAD · KARIM NOZAD O · KARIM NOZAD OSMAN
14 granted patents·248 citations·filing 2006–2023
92Inventor score
Files withAMKOR TECHNOLOGY INC6AMKOR TECH SINGAPORE HOLDING PTE LTD3CHUN JONG OK2HUEMOELLER RONALD PATRICK1KARIM NOZAD O1
Top patents by PatentIndex Score
14 records- 0196US8199518B1Top feature package and methodCHUN JONG OK·Filed 2010·Granted Jun 12, 2012·110 cites·20 claims
- 0294US8129824B1Shielding for a semiconductor packageST AMAND ROGER D·Filed 2008·Granted Mar 6, 2012·54 cites·21 claims
- 0393US7589398B1Embedded metal features structureAMKOR TECHNOLOGY INC·Filed 2006·Granted Sep 15, 2009·26 cites·19 claims
- 0492US9433117B1Shield lid interconnect package and methodCHUN JONG OK·Filed 2012·Granted Aug 30, 2016·14 cites·24 claims
- 0587US7911037B1Method and structure for creating embedded metal featuresAMKOR TECHNOLOGY INC·Filed 2009·Granted Mar 22, 2011·12 cites·20 claims
- 0686US11646290B2Shielded electronic component packageAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted May 9, 2023·1 cites·20 claims
- 0782US12040305B2Shielded electronic component packageAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Jul 16, 2024·0 cites·20 claims
- 0881US8072050B1Semiconductor device with increased I/O leadframe including passive deviceKARIM NOZAD O·Filed 2008·Granted Dec 6, 2011·14 cites·20 claims
- 0978US7832097B1Shielded trace structure and fabrication methodAMKOR TECHNOLOGY INC·Filed 2008·Granted Nov 16, 2010·6 cites·20 claims
- 1075US7958626B1Embedded passive component network substrate fabrication methodAMKOR TECHNOLOGY INC·Filed 2007·Granted Jun 14, 2011·6 cites·24 claims
- 1171US10424556B2Shielded electronic component packageAMKOR TECHNOLOGY INC·Filed 2016·Granted Sep 24, 2019·1 cites·8 claims
- 1267US9060430B1Shielded trace structure and fabrication methodHUEMOELLER RONALD PATRICK·Filed 2010·Granted Jun 16, 2015·1 cites·20 claims
- 1364US7915715B2System and method to provide RF shielding for a MEMS microphone packageAMKOR TECHNOLOGY INC·Filed 2008·Granted Mar 29, 2011·3 cites·17 claims
- 1463US11031366B2Shielded electronic component packageAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Jun 8, 2021·0 cites·23 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →