Inventor · disambiguated record
Seonghun Mun
Also filed as: MUN SEONGHUN
7 granted patents·57 citations·filing 2010–2013
83Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0195US8378476B2Integrated circuit packaging system with stacking option and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2010·Granted Feb 19, 2013·31 cites·20 claims
- 0286US8779562B2Integrated circuit packaging system with interposer shield and method of manufacture thereofLEE SEONGMIN·Filed 2011·Granted Jul 15, 2014·10 cites·18 claims
- 0378US9905491B1Interposer substrate designs for semiconductor packagesYOON IN SANG·Filed 2013·Granted Feb 27, 2018·5 cites·6 claims
- 0473US9184067B1Methods of mitigating defects for semiconductor packagesKIM KYUNGHWAN·Filed 2013·Granted Nov 10, 2015·4 cites·20 claims
- 0572US9331007B2Semiconductor device and method of forming conductive ink layer as interconnect structure between semiconductor packagesSTATS CHIPPAC LTD·Filed 2012·Granted May 3, 2016·3 cites·19 claims
- 0671US9748203B2Integrated circuit packaging system with conductive pillars and method of manufacture thereofYANG DEOKKYUNG·Filed 2011·Granted Aug 29, 2017·3 cites·10 claims
- 0757US8643181B2Integrated circuit packaging system with encapsulation and method of manufacture thereofBAE JOHYUN·Filed 2010·Granted Feb 4, 2014·1 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →