Inventor · disambiguated record
Derek Wyatt
Also filed as: WYATT DEREK · WYATT DEREK QUINN
3 granted patents·4 pending applications·3 citations·filing 2004–2018
55Inventor score
Top patents by PatentIndex Score
7 records- 0165US9688892B2Underfill composition and packaging process using the sameHenkel IP & Holding GmbH·Filed 2015·Granted Jun 27, 2017·2 cites·22 claims
- 0248US9092499B2Synchronizing endpoint data stores having disparate schemasWYATT DEREK QUINN·Filed 2012·Granted Jul 28, 2015·1 cites·23 claims
- 0342US10985108B2Compositions for gap coating and/or filling in or between electronic packages by capillary flow and methods for the use thereofHenkel IP & Holding GmbH·Filed 2018·Granted Apr 20, 2021·0 cites·20 claims
- 0439US2015331924A1Synchronizing endpoint data stores having disparate schemasBLACKBERRY LTD·Filed 2015·Application pending·0 cites
- 0533US2006210748A1Method for reducing freeze-thaw voids in uncured adhesivesWYATT DEREK·Filed 2006·Application pending·0 cites
- 0632US2005221035A1Method for reducing freeze-thaw voids in uncured adhesivesWYATT DEREK·Filed 2004·Application pending·0 cites
- 0728US2010007018A1Process for coating a bumped semiconductor waferWYATT DEREK·Filed 2009·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →