Inventor · disambiguated record
Munehiro Toyama
Also filed as: TOYAMA MUNEHIRO
12 granted patents·2 pending applications·68 citations·filing 2005–2019
91Inventor score
Top patents by PatentIndex Score
14 records- 0189US8115307B2Embedding device in substrate cavityTOYAMA MUNEHIRO·Filed 2009·Granted Feb 14, 2012·18 cites·14 claims
- 0286US7592202B2Embedding device in substrate cavityINTEL CORP·Filed 2006·Granted Sep 22, 2009·12 cites·7 claims
- 0385US7915060B2Grid array connection device and methodINTEL CORP·Filed 2010·Granted Mar 29, 2011·6 cites·7 claims
- 0483US7670951B2Grid array connection device and methodINTEL CORP·Filed 2005·Granted Mar 2, 2010·8 cites·6 claims
- 0581US9966351B2Grid array connection device and methodINTEL CORP·Filed 2016·Granted May 8, 2018·2 cites·20 claims
- 0680US7875503B2Reducing underfill keep out zone on substrate used in electronic device processingINTEL CORP·Filed 2006·Granted Jan 25, 2011·11 cites·20 claims
- 0779US9449936B2Grid array connection device and methodINTEL CORP·Filed 2015·Granted Sep 20, 2016·2 cites·10 claims
- 0872US9698114B2Grid array connection device and methodTOYAMA MUNEHIRO·Filed 2011·Granted Jul 4, 2017·2 cites·9 claims
- 0969US8362627B2Reducing underfill keep out zone on substrate used in electronic device processingINTEL CORP·Filed 2010·Granted Jan 29, 2013·3 cites·11 claims
- 1067US7432202B2Method of substrate manufacture that decreases the package resistanceINTEL CORP·Filed 2005·Granted Oct 7, 2008·4 cites·13 claims
- 1163US10741515B2Grid array connection device and methodINTEL CORP·Filed 2019·Granted Aug 11, 2020·0 cites·20 claims
- 1261US10373924B2Grid array connection device and methodINTEL CORP·Filed 2018·Granted Aug 6, 2019·0 cites·20 claims
- 1351US2009166858A1Lga substrate and method of making sameBCHIR OMAR J·Filed 2007·Application pending·0 cites
- 1448US2010301484A1Lga substrate and method of making sameBCHIR OMAR J·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →