Inventor · disambiguated record
Se-Hoon Cho
Also filed as: CHO SE-HOON
13 granted patents·3 pending applications·151 citations·filing 2004–2011
91Inventor score
Top patents by PatentIndex Score
16 records- 0193US7889037B2Magnetic levitation sliding structureSAMSUNG TECHWIN CO LTD·Filed 2008·Granted Feb 15, 2011·47 cites·19 claims
- 0292US7831286B2Sliding structure for electronic deviceSAMSUNG TECHWIN CO LTD·Filed 2007·Granted Nov 9, 2010·36 cites·24 claims
- 0384US8419880B2Method of transferring grapheneCHO SE-HOON·Filed 2011·Granted Apr 16, 2013·8 cites·20 claims
- 0477US7540663B2Hydrodynamic fluid film bearing and bearing housing with cooling capacitySAMSUNG TECHWIN CO LTD·Filed 2008·Granted Jun 2, 2009·6 cites·7 claims
- 0576US7374342B2Hydrodynamic fluid film bearing and bearing housing with cooling capacitySAMSUNG TECHWIN CO LTD·Filed 2005·Granted May 20, 2008·6 cites·15 claims
- 0675US8019397B2Magnetic levitation sliding structureSAMSUNG TECHWIN CO LTD·Filed 2008·Granted Sep 13, 2011·5 cites·16 claims
- 0773US7231236B2Integrated antenna and input/output port for a wireless communication deviceSAMSUNG TECHWIN CO LTD·Filed 2004·Granted Jun 12, 2007·15 cites·17 claims
- 0870US7907980B2Magnetic levitation sliding structureSAMSUNG TECHWIN CO LTD·Filed 2007·Granted Mar 15, 2011·3 cites·20 claims
- 0970US7345645B2Method of manufacturing substrate for circuit board and smart label having the substrateSAMSUNG TECHWIN CO LTD·Filed 2004·Granted Mar 18, 2008·14 cites·19 claims
- 1063US7995100B2Apparatus for controlling specific function and camera module having the sameSAMSUNG TECHWIN CO LTD·Filed 2005·Granted Aug 9, 2011·1 cites·10 claims
- 1162US7952175B2Lead frame, semiconductor package including the lead frame and method of forming the lead frameSAMSUNG TECHWIN CO LTD·Filed 2008·Granted May 31, 2011·3 cites·14 claims
- 1261US7070114B2Smart label and manufacturing method thereofSAMSUNG TECHWIN CO LTD·Filed 2004·Granted Jul 4, 2006·7 cites·12 claims
- 1344US2008139261A1Magnetic levitation sliding structureSAMSUNG TECHWIN CO LTD·Filed 2007·Application pending·0 cites
- 1436US7341889B2Lead frame for semiconductor package and method of fabricating semiconductor packageSAMSUNG TECHWIN CO LTD·Filed 2004·Granted Mar 11, 2008·0 cites·9 claims
- 1533US2011315657A1Method and apparatus for manufacturing graphene transfer filmCHO SE-HOON·Filed 2011·Application pending·0 cites
- 1630US2012025413A1Method of manufacturing grapheneCHO SEUNG-MIN·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →