Inventor · disambiguated record
Kuniko Ishikawa
Also filed as: ISHIKAWA KUNIKO
6 granted patents·9 pending applications·24 citations·filing 2006–2013
78Inventor score
Top patents by PatentIndex Score
15 records- 0183US8418910B2Electroconductive bonding material, method for bonding conductor, and method for manufacturing semiconductor deviceYAMAKAMI TAKATOYO·Filed 2012·Granted Apr 16, 2013·8 cites·10 claims
- 0276US7566586B2Method of manufacturing a semiconductor deviceFUJITSU LTD·Filed 2006·Granted Jul 28, 2009·7 cites·11 claims
- 0374US7828193B2Method of mounting an electronic component and mounting apparatusFUJITSU LTD·Filed 2007·Granted Nov 9, 2010·6 cites·7 claims
- 0472US8861903B2Method of manufacturing optical waveguide device and optical waveguide deviceFUJITSU LTD·Filed 2012·Granted Oct 14, 2014·1 cites·15 claims
- 0564US7833831B2Method of manufacturing an electronic component and an electronic deviceFUJITSU LTD·Filed 2007·Granted Nov 16, 2010·2 cites·10 claims
- 0649US2013249087A1Electronic component and manufacture method thereofFUJITSU LTD·Filed 2013·Application pending·0 cites
- 0746US2013140069A1Conductive bonding material, electronic component, and electronic deviceFUJITSU LTD·Filed 2012·Application pending·0 cites
- 0845US8076233B2Method of forming electrode connecting portionISHIKAWA KUNIKO·Filed 2009·Granted Dec 13, 2011·0 cites·6 claims
- 0944US2010327435A1Electronic component and manufacture method thereofFUJITSU LTD·Filed 2010·Application pending·0 cites
- 1043US2014103117A1Rfid tagFUJITSU LTD·Filed 2013·Application pending·0 cites
- 1142US2013313309A1Conductive bonding material, method of manufacturing the same, and method of manufacturing electronic deviceFUJITSU LTD·Filed 2013·Application pending·0 cites
- 1241US2013088839A1Board module manufacturing method, board module, and board module assemblyFUJITSU LTD·Filed 2012·Application pending·0 cites
- 1340US2013087605A1Conductive bonding material, conductor bonding method, and semiconductor device production methodKUBOTA TAKASHI·Filed 2012·Application pending·0 cites
- 1439US2012248616A1Electronic component, electronic equipment, and soldering pasteKITAJIMA MASAYUKI·Filed 2012·Application pending·0 cites
- 1537US2011079896A1Semiconductor device and semiconductor device fabrication methodFUJITSU LTD·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →