Inventor · disambiguated record
Chi-Hwa Tsang
Also filed as: TSANG CHI-HWA
13 granted patents·3 pending applications·339 citations·filing 1985–2022
93Inventor score
Top patents by PatentIndex Score
16 records- 0191US7432200B2Filling narrow and high aspect ratio openings using electroless depositionINTEL CORP·Filed 2005·Granted Oct 7, 2008·24 cites·17 claims
- 0285US4713141AAnisotropic plasma etching of tungstenINTEL CORP·Filed 1986·Granted Dec 15, 1987·70 cites·16 claims
- 0381US7070687B2Apparatus and method of surface treatment for electrolytic and electroless plating of metals in integrated circuit manufacturingINTEL CORP·Filed 2001·Granted Jul 4, 2006·26 cites·27 claims
- 0480US4690728APattern delineation of vertical load resistorINTEL CORP·Filed 1986·Granted Sep 1, 1987·53 cites·30 claims
- 0579US9123706B2Electroless filled conductive structuresZIERATH DANIEL J·Filed 2011·Granted Sep 1, 2015·7 cites·18 claims
- 0679US7622382B2Filling narrow and high aspect ratio openings with electroless depositionINTEL CORP·Filed 2006·Granted Nov 24, 2009·7 cites·11 claims
- 0779US5262279ADry process for stripping photoresist from a polyimide surfaceINTEL CORP·Filed 1992·Granted Nov 16, 1993·41 cites·12 claims
- 0875US6761625B1Reclaiming virgin test wafersINTEL CORP·Filed 2003·Granted Jul 13, 2004·16 cites·10 claims
- 0973US5358891ATrench isolation with planar topography and method of fabricationINTEL CORP·Filed 1993·Granted Oct 25, 1994·56 cites·15 claims
- 1073US4666555APlasma etching of silicon using fluorinated gas mixturesINTEL CORP·Filed 1985·Granted May 19, 1987·39 cites·8 claims
- 1170US11869894B2Metallization structures for stacked device connectivity and their methods of fabricationINTEL CORP·Filed 2022·Granted Jan 9, 2024·0 cites·20 claims
- 1256US11430814B2Metallization structures for stacked device connectivity and their methods of fabricationINTEL CORP·Filed 2018·Granted Aug 30, 2022·0 cites·25 claims
- 1343US2015371949A1Electroless filled conductive structuresINTEL CORP·Filed 2015·Application pending·0 cites
- 1441US2011147831A1Method for replacement metal gate fillSTEIGERWALD JOSEPH M·Filed 2009·Application pending·0 cites
- 1540US11417567B2Conductive cap-based approaches for conductive via fabrication and structures resulting therefromINTEL CORP·Filed 2016·Granted Aug 16, 2022·0 cites·23 claims
- 1635US2004235390A1Reclaiming virgin test wafersFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →